Microwelding of glass to silicon by green ultrafast laser pulses

Zhang, Jiejuan; Xu, Sizhi; Dong, Yukun; Zhang, Congzheng; Li, Jiaming; Liang, Guo; Zhang, Qingmao

doi:10.1016/j.optlastec.2019.105720

Cited by 15 publications

(2 citation statements)

References 20 publications

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“…It is clear in Figure 10c that too high and too low a focal position caused insufficient melt to bridge the gap, thus resulting in a decreased bonding area and joint strength, which is different from the results in Figure 10a. The inconsistency in the results is likely to stem from the too narrow range of focal positions chosen by Zhang et al [57]. Additionally, Figure 10 also shows the downward shift of the optimized focal position corresponding to the maximum bonding strength when increasing the scanning speed.…”

Section: Focal Positionmentioning

confidence: 93%

A Review on Ultrafast Laser Microwelding of Transparent Materials and Transparent Material–Metals

Jiang

Yang

et al. 2023

Metals

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Transparent hard and brittle (THB) materials have generated significant interest due to their excellent properties, such as wide spectral transmittance, heat resistance, chemical inactivity and high mechanical strength. To further explore the application of THB materials, it is inevitable to be confronted with a range of joining THB materials and THB material–metals. Ultrafast (UF) laser microwelding enables a new means of joining THB materials and THB material–metals, due to a localized energy deposition method, which is dominated by nonlinear absorption. This process can realize high-quality micro-zone direct joining of THB materials or THB material–metals without the assistance of a light-absorbing intermediate layer. In this paper, we review the advances in UF laser microwelding of THB materials and THB material–metals considering the last two decades, from the analysis of the interaction mechanism between UF laser and matter to the key influencing factors and practical applications of this technology. Finally, the existing problems and the future research focus of UF laser microwelding technology of THB materials and THB material–metals are discussed.

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Section: Focal Positionmentioning

confidence: 93%

A Review on Ultrafast Laser Microwelding of Transparent Materials and Transparent Material–Metals

Jiang

Yang

et al. 2023

Metals

View full text Add to dashboard Cite

show abstract

“…Previous studies on glass/glass welding using fs-lasers have suggested that the favorable focal plane position is usually below the interface to obtain higher bonding strength [26,27]. For bonding glass with non-transparent materials using a ps-laser or fs-laser, the optimal focal plane position could be either above, at, or below the interface, depending on other process parameters [14,28].…”

Section: Bonding Strengthmentioning

confidence: 99%

Characterizations of Laser Transmission Welding of Glass and Copper Using Nanosecond Pulsed Laser

Nguyen,

Lin,

Tung

et al. 2023

Preprint

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In this study, we conducted an investigation into the heterogeneous bonding process of glass and copper using a nanosecond pulsed laser for laser transmission welding. Our research focused on examining various processing parameters and the influence of focal plane positions on bonding quality. To evaluate weld strength, we employed both pull-tensile separation force (PTSF) and shear-tensile separation force (STSF) measurements. The analysis of fracture and separation results encompassed detailed examinations of weld morphology, microstructure, elemental composition, and phase configuration. The results revealed that increasing the laser welding energy initially enhanced the weld strength until it reached a saturation point. This saturation point was attributed to the formation of voids or cracks, leading to residual stress within the weld zone due to non-uniform hot spots in the molten area during processing. Among the different focal plane positions tested, positioning it below the glass/copper interface yielded the highest weld strength. The maximum achieved bond strength was above 10 MPa, demonstrating the feasibility of cost-effective pulsed laser welding for copper-to-glass applications. Furthermore, the welds exhibited superior resistance to STSF compared to PTSF. PTSF caused breaking at the weld seam-glass boundary, leaving the weld seam on the copper plate, whereas STSF resulted in separation along the weld-copper interface, leaving the weld seam on the glass sheet. In-depth analysis through SEM and EDS elucidated that Cu and SiO2 underwent intra-mixing and inter-particle diffusion in the molten pool during welding. HR-TEM and SAED observations unveiled the presence of polycrystalline copper nanoparticles, copper oxides, and an amorphous Cu-O-Si region at the weld interface. This amorphous region significantly contributed to the robust bonding between copper and glass.

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Characterizations of laser transmission welding of glass and copper using nanosecond pulsed laser

Nguyen,

Lin,

Tung

et al. 2023

Int J Adv Manuf Technol

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Microwelding of glass to silicon by green ultrafast laser pulses

Cited by 15 publications

References 20 publications

A Review on Ultrafast Laser Microwelding of Transparent Materials and Transparent Material–Metals

A Review on Ultrafast Laser Microwelding of Transparent Materials and Transparent Material–Metals

Characterizations of Laser Transmission Welding of Glass and Copper Using Nanosecond Pulsed Laser

Characterizations of laser transmission welding of glass and copper using nanosecond pulsed laser

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