Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)Help me understand this report
Microwave multichip modules using low cost microwave chip on flex packaging technology
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“…In MCOF technology [1], bare die are placed face down on an adhesive backed flex circuit. The first level of the circuit is a pre-patterned titanium copper thin film metal system on a polyimide dielectric material.…”
mentioning
confidence: 99%
“…In MCOF technology [1], bare die are placed face down on an adhesive backed flex circuit. The first level of the circuit is a pre-patterned titanium copper thin film metal system on a polyimide dielectric material.…”
mentioning
confidence: 99%
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