Microstructures of BPDA-PPD polyimide thin films with different thicknesses

Kotera, Masaru; Samyul, Boo; Araie, Kouhei; Sugioka, Yuri; Nishino, Takashi; Maji, Satoshi; Noda, Miki; Senoo, Kazunobu; Koganezawa, Tomoyuki; Hirosawa, Ichiro

doi:10.1016/j.polymer.2013.03.005

Cited by 19 publications

(9 citation statements)

References 19 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…After curing reaction at 370 1C, the sharp absorption peaks at 1550 and 1360 cm À 1 were ascribed to the stretching vibration absorption of N-H, O-H and CO-NH disappeared. The absorption peaks at 1780-cm À 1 and 1720-cm À 1 appeared in PI samples were related to the stretching vibration absorption of C ¼O in the imide structure which indicated that the PAA nonwoven was effectively converted into the corresponding PI nonwoven by thermal imidization [22,23].…”

Section: Resultsmentioning

confidence: 97%

The high performances of SiO 2 /Al 2 O 3 -coated electrospun polyimide fibrous separator for lithium-ion battery

Liang

Yang

Jin

et al. 2015

Journal of Membrane Science

156

View full text Add to dashboard Cite

Section: Resultsmentioning

confidence: 97%

The high performances of SiO 2 /Al 2 O 3 -coated electrospun polyimide fibrous separator for lithium-ion battery

Liang

Yang

Jin

et al. 2015

Journal of Membrane Science

156

View full text Add to dashboard Cite

“…In addition, diffraction peaks (2 θ ) were located at 18° and 1.67° for 2‐HPI and 2‐OPI, respectively, and d spacing could be calculated as 4.9 Å for 2‐HPI and 52 Å for 2‐OPI. Considering that the d spacing obtained from XRD reflections corresponds to interchain Packing, the result indicated that the long period, the average distance between the ordered regions, was shorter for 2‐HPI because of its greater flexibility than 2‐OPI.…”

Section: Resultsmentioning

confidence: 99%

Effect of multiple H-bonding on the properties of polyimides containing the rigid rod groups

Kang

Chen

et al. 2015

J. Polym. Sci. Part A: Polym. Chem.

View full text Add to dashboard Cite

To investigate the influence of hydrogen bonding on the properties of polyimides (PIs) containing rigid rod‐like groups, five symmetrical diamines containing benzimidazole, benzoxazole, and hydroxy group were synthesized, and then a series of PIs were prepared. Results showed that hydroxyl‐containing poly(benzoxazole imide)s possess higher glass transition temperature (Tg) and dimensional stabilities than their corresponding poly(benzoxazole imide)s. Moreover, the corresponding poly(benzimidazole imide)s presented the best performances, such as the highest Tg, the highest char yield and the highest dimensional stabilities. The influence of hydrogen bonding of benzimidazole on the properties of PIs was stronger than that of hydroxyl groups. Hydroxyl‐containing poly(benzoxazole imide)s were formed in crosslinking structures after heat treatment at 400 °C. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016, 54, 570–581

show abstract

“…Depending on the imide monomers used for the polymerization, different kinds of PI can be obtained and the 3,4,3′,4′-biphenyltetracarboxylic dianhydride -p-phenylene diamine (BPDA/PPD) is the most commonly used in the biomedical field due to its biocompatibility. [162][163][164][165][166] PI is commonly used as a spinnable substrate (after proper curing), sacrificial layer, or adhesion layer: [167][168][169] most of the flexible/stretchable neural implants are made of a skeleton in PI as a carrier for microelectronic devices, embedded in a soft elastomer. [170,171] As for parylene, studies on long-term reliability of PI have been conducted through PBS soaking tests of microelectrode arrays (MEAs) and IDE patterns, resulting in equivalent lifetimes of 66 days at 75 °C (2.5 years at 37 °C) with 10 µm-thick encapsulation [155] and 300 days at 60 °C (4-7 years at 37 °C) with 5-12.5 µm-thick encapsulation.…”

Section: Single-layer Tfementioning

confidence: 99%

Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods

Mariello

Kim

et al. 2022

Advanced Materials

View full text Add to dashboard Cite

Bioelectronic implantable systems (BIS) targeting biomedical and clinical research should combine long‐term performance and biointegration in vivo. Here, recent advances in novel encapsulations to protect flexible versions of such systems from the surrounding biological environment are reviewed, focusing on material strategies and synthesis techniques. Considerable effort is put on thin‐film encapsulation (TFE), and specifically organic–inorganic multilayer architectures as a flexible and conformal alternative to conventional rigid cans. TFE is in direct contact with the biological medium and thus must exhibit not only biocompatibility, inertness, and hermeticity but also mechanical robustness, conformability, and compatibility with the manufacturing of microfabricated devices. Quantitative characterization methods of the barrier and mechanical performance of the TFE are reviewed with a particular emphasis on water‐vapor transmission rate through electrical, optical, or electrochemical principles. The integrability and functionalization of TFE into functional bioelectronic interfaces are also discussed. TFE represents a must‐have component for the next‐generation bioelectronic implants with diagnostic or therapeutic functions in human healthcare and precision medicine.

show abstract

Microstructures of BPDA-PPD polyimide thin films with different thicknesses

Cited by 19 publications

References 19 publications

The high performances of SiO 2 /Al 2 O 3 -coated electrospun polyimide fibrous separator for lithium-ion battery

The high performances of SiO 2 /Al 2 O 3 -coated electrospun polyimide fibrous separator for lithium-ion battery

Effect of multiple H-bonding on the properties of polyimides containing the rigid rod groups

Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods

Contact Info

Product

Resources

About