Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging

Huang, Jiaqiang; Zhou, Min-Bo; Zhao, Xing-Fei; Zhang, Xin-Ping

doi:10.1109/icept.2017.8046752

Cited by 4 publications

(1 citation statement)

References 16 publications

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“…These studies have not been successful, as the brittle nature of eutectic Sn-Bi has proven to be largely unmodifiable [21]. Additionally, there have been attempts to obtain a composite solder with better performance by mixing the two solders [22][23][24][25][26][27]; however, the reflow temperature is still high. Thus, there is an urgent need for a low-temperature assembly technology to replace eutectic Sn-Bi for use in industrial applications of mobile devices.…”

Section: Introductionmentioning

confidence: 99%

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

et al. 2022

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We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

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