Microstructures and properties of Sn–0.3Ag–0.7Cu solder doped with graphene nanosheets

Yin, Limeng; Zhang, Zhongwen; Zuo, Cunguo; Fang, Naiwen; Zhang, Yao; Su, Zilong

doi:10.1007/s10854-019-02705-y

Cited by 11 publications

(5 citation statements)

References 22 publications

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“…To meet the growing demand of Pb-free alloys in microelectronic assemblies, tin (Sn) and its alloys have emerged as a suitable alternative to the potentially hazardous lead-containing Sn-Pb solder alloys. Recently, the most prominent alternative alloys utilized in microelectronic packaging embrace Sn-Cu, Sn-Bi, Sn-Zn, Sn-Ag, and Sn-Ag-Cu systems [1]. The Sn-Ag-Cu (SAC) alloy family has consistently proven to be the most promising Pb-free alloys due to its superior solderability, high reflow temperature, mechanical incentives, and reliability [2].…”

Section: Introductionmentioning

confidence: 99%

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Eid,

El-Daly,

Hammad

et al. 2023

Phys. Scr.

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The use of innovative Co-Mg-La ferrite nanoparticles (ferrite) facilitates the production of superior Pb-free solder alloy materials that suffer from the strength-ductility trade-off (SDT). The current study introduces an original Pb-free Sn-1Ag-0.5Cu (SAC105) electrical connection alloy. It is fortified with cutting-edge ferrite and nickel providing a novel approach for improving SDT by avoiding early necking throughout different temperatures. The heterogeneous structures in Sn-1Ag-0.5Cu (SAC105) alloy are assembled by controlling a fraction of reinforcing ferrite and Ni, processed under cold-drawn and partial recrystallization. The optimal ferrite concentration in SAC105 composites is about 0.3wt%, which possesses a significant strain hardening potential and the highest strength-ductility synergy. The excessive degree of heterogeneity of SAC105-0.3ferrite induces numerous strengthening mechanisms and dislocation accumulation, resulting in attaining high ultimate tensile strength (UTS) of 40.7 MPa with significant ductility of ∼ 47.7%, with ∼ 34.3% and 39% increasing when compared to SAC105. Once SAC105 solder was doped with 0.3 wt.% ferrite or 0.05Ni with 0.3 wt.% ferrite, the activation energy transferred from pipe diffusion to lattice diffusion. The solitary Ni addition, on the other hand, results in the SDT of plain SAC105.

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Section: Introductionmentioning

confidence: 99%

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Eid,

El-Daly,

Hammad

et al. 2023

Phys. Scr.

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“…However, the spreading ratio decreases with excess GNSs added into the solder, which may be attributed to the fact that a higher content of GNSs can make them flow out from the melting solder. In addition, Yin et al [ 18 ] have investigated the impact of GNSs on the microstructure, tensile strength and wettability of the Sn-0.3Ag-0.7Cu solder. The wettability test result shows that the addition of GNSs can improve the wettability of solder and that the contact angle of composite solder is reduced by approximately 29% when 0.01% of GNS is added.…”

Section: Resultsmentioning

confidence: 99%

“…To explore more possibilities of the applications of lead-free solder alloy, graphene nanosheets (GNSs) were introduced into Sn-20Bi solder. Graphene nanosheets proved to be effective for the reinforcement of the properties of solder, such as Sn-58Bi [ 17 ] and Sn-Ag-Cu [ 18 ]. However, the further study of Sn-20Bi solder alloy is still needed.…”

Section: Introductionmentioning

confidence: 99%

Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints

Yang

et al. 2020

Materials

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Graphene nanosheets (GNSs) have an extensive application in materials modification. In this study, the effects of graphene nanosheets on the wettability of Sn-20Bi lead-free solder on copper (Cu) substrate and the growth behavior of intermetallic compound (IMC) layers at Sn-20Bi-xGNS/Cu solder joints were investigated. The experimental results indicate that the wettability of Sn-20Bi solder firstly diminished and then increased by the addition of GNSs. Meanwhile, a prism-shaped and scallop-shaped Cu6Sn5 IMC layer was clearly observed at the interface of the solder/substrate system. Moreover, it was found that a small amount of GNS addition can significantly inhibit the growth of the IMC layer at the interface as well as refine the microstructure. Additionally, by nano-indentation apparatus, it can be concluded that the hardness and elastic module of IMCs show the same variation trend, which firstly decreased and then increased. Besides, to intuitively demonstrate the reliability of IMCs, the relationship between the hardness and elastic module was established, and the ratio of hardness/elastic module (H/E) was adopted to characterize the reliability of IMCs. The results show that when the addition of GNSs was 0.02 wt%, the value of H/E is the minimum and the solder joint has the highest reliability.

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“…The intermetallic compounds (IMCs) Ag 3 Sn and Cu 6 Sn 5 at the solder joints are in coarse slats after aging of the solder. They are brittle and affect reliability [ [21] , [22] , [23] , [24] , [25] , [26] ]. Low silver content solder can reduce the cost of solder.…”

Section: Introductionmentioning

confidence: 99%

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Xiao,

Cheng,

Fu-kang

2024

Heliyon

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Microstructures and properties of Sn–0.3Ag–0.7Cu solder doped with graphene nanosheets

Cited by 11 publications

References 22 publications

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite

Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

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