Microstructure, Tensile Mechanical Properties and Electrical Fatigue Mechanism of a Microalloyed Copper Wire

Zhao, Jun-Ren; Lin, Yu‐Che; Hung, Fei-Yi

doi:10.1007/s11664-022-09835-w

Cited by 6 publications

(2 citation statements)

References 24 publications

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“…The addition of precious metal elements is beneficial for improving ball bonding shape, enhancing bond strength, and suppressing surface oxidation. Jun-Ren Zhao et al [ 40 , 41 ] studied the performance of Cu wires by adding trace amounts of Au, Pd, and Pt individually. The results showed that the addition of Au or Pd had a grain refining effect, whereas the addition of Pt significantly increased the resistance of Cu wire.…”

Section: Types Of Cu-bonding Wirementioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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Section: Types Of Cu-bonding Wirementioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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“…At present, LED package qualifications rely on time-consuming thermal cycling and thermal shock tests or simple extrapolations from the static material parameters obtained using bending, pull, or shear tests with finite element modeling (FEM) simulations [16][17][18][19][20][21][22][23]. Highly accelerated reliability tests, designed to replicate typical application conditions in an accelerated manner, provide essential parameters to improve material models for life prediction and FEM simulations.…”

Section: Introductionmentioning

confidence: 99%

Bond Wire Fatigue of Au, Cu, and PCC in Power LED Packages

Czerny,

Schuh

2023

Micromachines

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Bond wire failure, primarily wire neck breakage, in power LED devices due to thermomechanical fatigue is one of the main reliability issues in power LED devices. Currently, the standard testing methods to evaluate the device’s lifetime involve time-consuming thermal cycling or thermal shock tests. While numerical or simulation methods are used as convenient and quick alternatives, obtaining data from material lifetime models with accurate reliability and without experimental fatigue has proven challenging. To address this issue, a mechanical fatigue testing system was developed with the purpose of inducing mechanical stresses in the critical region of the bond wire connection above the ball bond. The aim was to accelerate fatigue cracks at this bottleneck, inducing a similar failure mode as observed during thermal tests. Experimental investigations were conducted on Au, Cu, and Pd-coated Cu bonding wires, each with a diameter of 25 µm, using both low- and high-frequency excitation. The lifetime of the wire bond obtained from these tests ranged from 100 to 1,000,000 cycles. This proposed testing method offers material lifetime data in a significantly shorter timeframe and requires minimal sample preparation. Additionally, finite element simulations were performed to quantify the stresses at the wire neck, facilitating comparisons to conventional testing methods, fatigue test results under various operating conditions, material models, and design evaluations of the fine wire bond reliability in LED and microelectronic packages.

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Study of tensile properties, electrothermal characteristics and packaging reliability on Cu–Pt–Au–Pd fine micro-alloyed wire

Hsu

Hung

2023

J Mater Sci: Mater Electron

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Microstructure, Tensile Mechanical Properties and Electrical Fatigue Mechanism of a Microalloyed Copper Wire

Cited by 6 publications

References 24 publications

Copper Wire Bonding: A Review

Copper Wire Bonding: A Review

Bond Wire Fatigue of Au, Cu, and PCC in Power LED Packages

Study of tensile properties, electrothermal characteristics and packaging reliability on Cu–Pt–Au–Pd fine micro-alloyed wire

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