“…However, it has been shown that in FCC materials these junctions are relatively stable [61]. High thermal stability is reported, specifically for nickel electrodeposits with a <110> fiber texture and five-fold twin boundary junctions [33], [34] which are encompassed by g-HAGB forming isolated units (unlike sample S3 which has a connected helical struture of five-fold junctions). Therefore, to understand the poor thermal stability, the dynamics of grain boundary interaction and the effect of connectivity of the grain boundaries should be considered.…”