Microstructure of combined electroless and galvanic deposits on roll annealed copper foils and copper single crystals

Abbasi, M.H.; Brown, Delilah A.; Bernhard, T.; Klaeden, K.; Schulze, Jörg; Zarwell, Sebastian; Brüning, Ralf

doi:10.1016/j.tsf.2020.138366

Cited by 4 publications

(2 citation statements)

References 20 publications

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“…14 Facet selection is important for electroless and galvanic plating processes in the PCB industry. The orientation of surface facets of the electroless Cu layer has a major effect on the initial codeposition of galvanic Cu additives with implications to the final surface roughness of the stack 1,15,16 and subsequent recrystallization processes. 17…”

Section: Introductionmentioning

confidence: 99%

Facet type determination based on combined atomic force microscopy and electron backscatter diffraction

Brüning

Hajati

Lelièvre

et al. 2023

Journal of Microscopy

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The distribution of facet types affects the functionality of the surfaces of polycrystalline films. However, we are not aware of a previously published convenient method to determine their distribution. This work describes and demonstrates a process to determine and map the Miller indexes (hkl) of crystal facets exposed at the surfaces of polycrystalline films. To find facet types in non‐trivial cases, one must know the orientation of the crystal and the direction in which the facet is facing. The method presented here combines the crystal orientations obtained with electron backscatter diffraction with the topography of the same sample area measured with atomic force microscopy. A challenging step is to transfer the data from the two instruments into a common coordinate system. The sequence of steps in the data processing is presented, with methods to verify the results. The process is illustrated with the analysis of an etched copper clad laminate (CCL) and an electroless Cu film deposited on the CCL. This example relates to facet selection in electroless and galvanic plating processes in printed circuit board production, where an uncontrolled transition from epitaxial to non‐epitaxial growth can lead to surfaces with unacceptable roughness.

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Section: Introductionmentioning

confidence: 99%

Facet type determination based on combined atomic force microscopy and electron backscatter diffraction

Brüning

Hajati

Lelièvre

et al. 2023

Journal of Microscopy

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“…[ 1 ] Copper foils play a “neural network” role in electronic equipment communication and signal transmission. [ 2 ] However, the size of traditional metal conductors such as copper and aluminum in the printed circuit board (PCB) has shrunk sharply and signal transmission is concentrated on the surface of the conductors, [ 3 ] resulting in signal transmission failure, breakage, and continuous heating of the PCB. [ 4 ] It is urgent to develop copper foils with low surface roughness, high tensile strength, and good thermal conductivity simultaneously.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Surface Roughness and Tensile Strength of Electrodeposited Copper Foils by Composite Additives

Wang

Wei

et al. 2022

Physica Status Solidi (a)

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It is urgent to develop copper foils with low surface roughness, high tensile strength, and good thermal conductivity in electronic equipment communication. Herein, the effect of three single additives (gelatin, polyacrylamide, and thiourea) and two composite additives (gelatin–polyacrylamide and thiourea–polyacrylamide (Tu‐PAM)) on the surface roughness, tensile strength, and thermal conductivity of copper foils fabricated by direct current electrodeposition is investigated. The results show that when Tu‐PAM additives are added to the electrolyte, the –NH2 in the composite additive forms a complex with Cu2+ in the electrolyte, which increases the deposition current density, accelerates the formation of crystal nuclei, and reduces the size of the deposited particles. The size of the deposited particles is smaller, and the surface of the copper foil is flatter than that when the additive is added alone. The surface roughness, tensile strength, and thermal conductivity of copper foils are 1.506 ± 0.147 μm, 258 ± 20 MPa, and 356 ± 18 W m−1 k−1, respectively. It is revealed that the ionic interaction and the deposited particle size play an important role in enhancing surface roughness and tensile strength.

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Improving the roughness of copper working electrode through electroless deposition for carbon dioxide reduction reaction

Thienprasert,

Natesan,

Manan

et al. 2024

Materials Research Bulletin

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Microstructure of combined electroless and galvanic deposits on roll annealed copper foils and copper single crystals

Cited by 4 publications

References 20 publications

Facet type determination based on combined atomic force microscopy and electron backscatter diffraction

Facet type determination based on combined atomic force microscopy and electron backscatter diffraction

Enhancing Surface Roughness and Tensile Strength of Electrodeposited Copper Foils by Composite Additives

Improving the roughness of copper working electrode through electroless deposition for carbon dioxide reduction reaction

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