2009
DOI: 10.1016/j.jcrysgro.2008.09.096
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Microstructure evolution with RTA temperature in nano-thick (Ru or Au)-inserted nickel silicides

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Cited by 2 publications
(2 citation statements)
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“…It should be mentioned that we have considered formation of Au silicide, which has been reported in the literature to be formed at elevated temperatures, even below 500 °C. However, Au silicide is likely present in minor quantities, and is reported to have only a small effect on electrical conductance [7].…”
Section: Resultsmentioning
confidence: 99%
“…It should be mentioned that we have considered formation of Au silicide, which has been reported in the literature to be formed at elevated temperatures, even below 500 °C. However, Au silicide is likely present in minor quantities, and is reported to have only a small effect on electrical conductance [7].…”
Section: Resultsmentioning
confidence: 99%
“…There have been numerous research works conducted to enhance the thermal stability of NiSi films. Incorporation of other metal elements such as Zr, 9) Ru, 10) Au, 10) Pt 11,12) at the interface between Ni films and the Si substrate to stabilize NiSi films over 800 °C has been recently reported. The other methods are ion implantation or plasma treatment before Ni deposition to enhance thermal stability of NiSi.…”
Section: Introductionmentioning
confidence: 99%