2019
DOI: 10.1016/j.jmst.2018.10.005
|View full text |Cite
|
Sign up to set email alerts
|

Microstructure evolution and interface structure of Al-40 wt% Si composites produced by high-energy ball milling

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
7
0

Year Published

2019
2019
2023
2023

Publication Types

Select...
8
1

Relationship

3
6

Authors

Journals

citations
Cited by 47 publications
(7 citation statements)
references
References 38 publications
0
7
0
Order By: Relevance
“…However, traditional NPG-preparation methods are relatively complicated and have many limitations, , such as the inevitable occurrence of residual inert elements, intricate preparation process of the precursor alloy, harsh corrosion conditions, and existence of microcracks. Very recently, NPG was also found to be achievable through a so-called metal-induced crystallization (MIC) process. Given this background, in this work, we have employed a MIC-based solid phase reaction to prepare NPGs with irregularly shaped Au-nanobranch structures and further investigated them as new electrocatalysts for EORs.…”
Section: Introductionmentioning
confidence: 99%
“…However, traditional NPG-preparation methods are relatively complicated and have many limitations, , such as the inevitable occurrence of residual inert elements, intricate preparation process of the precursor alloy, harsh corrosion conditions, and existence of microcracks. Very recently, NPG was also found to be achievable through a so-called metal-induced crystallization (MIC) process. Given this background, in this work, we have employed a MIC-based solid phase reaction to prepare NPGs with irregularly shaped Au-nanobranch structures and further investigated them as new electrocatalysts for EORs.…”
Section: Introductionmentioning
confidence: 99%
“…However, the crystallization temperature can be reduced to as low as 100 °C by placing the a-Ge in contact with crystalline Al or Au (c-Au) [17,18]. MIC has been found to originate from atomic scale interactions and the interdiffusion of metal and amorphous semiconductors [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…As shown in Figure 9, during the MA process, a lot of iron (Fe) from the milling medium was incorporated into the inner of the powders and then enclosed by them. Additionally, the interaction between ball-to-wall and ball-to-ball collisions is responsible for the recurrent fracturing, welding, and rewilding of particles that happened during the MA process [48,49].…”
Section: Characterization Of Ti09cr01c Powders Prepared Via Mamentioning
confidence: 99%