Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

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Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

Cited by 10 publications

References 54 publications

Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates

Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates

Microstructure and mechanical properties of AlN and Cu joint using SnAgTi solder metal

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

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