Microstructure-dependent oxidation-assisted dealloying of Cu0.7Al0.3 thin films

Su, Jiangbin; Jiang, Meiping; Wang, Honghong; Liu, Yang

doi:10.1134/s102319351509013x

Cited by 7 publications

(6 citation statements)

References 15 publications

(29 reference statements)

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“…In order to enhance the performances of these CuO-based surface-sensitive materials and devices, people can prepare CuO thin films of porous structure or deposit CuO thin films on textured Si wafers to obtain a higher specific surface area. In the existing literature, there have been many studies on the fabrication of porous CuO thin films [2][3][4][5][6][7][8][9][10] while few studies on the deposition of CuO thin films on textured Si wafers [2]. For the deposition of thin films on textured Si wafers, it can be roughly equivalent to a planar thin film deposition with an enlarged specific surface area in most cases.…”

Section: Introductionmentioning

confidence: 99%

Selective bias deposition of CuO thin film on unpolished Si wafer

Wang

et al. 2020

Mater. Res. Express

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In order to enhance the performances of CuO-based surface-sensitive materials and devices, one feasible scheme is depositing CuO thin films on textured Si wafers to enlarge the specific surface area. In this work, the bias deposition of CuO thin film on unpolished Si wafer was carried out in a RF balanced magnetron sputtering system. The as-achieved CuO thin film was further characterized with scanning electron microscope, powder x-ray diffractometer and ultraviolet-visible spectrophotometer. It was found that the CuO thin film shows a pyramid-textured film morphology consisting of composite structures: a loose and porous thinner film at the bottom of bevel, a dense and compact thicker film at the top of bevel and on the underside, and many nanosheets standing on the film surface. The tip charging effect and bevel influence were discussed to reveal the selective deposition mechanism of CuO thin film on the unpolished Si wafer. It was also demonstrated that the unpolished rough Si wafer surface seems more suitable for the crystallization of CuO along (002) orientation rather than (111) orientation. Meanwhile, the CuO thin film on unpolished Si wafer exhibits the strongest absorption at the wavelength of ∼554 nm and a band gap of 1.94 eV, both of which show redshift relative to those of CuO thin film on polished Si wafer.

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Section: Introductionmentioning

confidence: 99%

Selective bias deposition of CuO thin film on unpolished Si wafer

Wang

et al. 2020

Mater. Res. Express

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“…Dealloying was initially proposed for the fabrication of porous metal thick films and then was further developed to fabricate metal oxide PNFs by Su et al [10,11]. Nevertheless, both of them may introduce impurities to the porous films from the solution.…”

Section: Introductionmentioning

confidence: 99%

“…We call such porous nanostructure-films or nanostructured films hereafter porous nanostructured films (PNFs) for short. Due to the unique size or curvature effect of building nanostructures along with the increased porosity and surface area, it is expected that such thin films of PNF structures may have some different or improved performances in contrast to the traditional porous and solid thin films [11,12]. Thus, it makes great sense to fabricate Cu 2 O PNFs with tunable building nanostructures and further study their corresponding properties.…”

Section: Introductionmentioning

confidence: 99%

Cu₂O porous nanostructured films fabricated by positive bias sputtering deposition

Zhu¹,

Ma²,

Zhou³

et al. 2019

Nanotechnology

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In this work, the authors fabricated Cu2O porous nanostructured films (PNFs) on glass slide substrates by the newly developed positive bias deposition approach in a balanced magnetron sputtering (MS) system. It was found that the surface morphology, crystal structure and optical property of the as-deposited products were greatly dependent on the applied positive substrate bias. In particular, when the substrate was biased at +50 V and +150 V, both of the as-prepared Cu2O PNFs exhibited a unique triangular pyramids-like structure with obvious edges and corners and little gluing, a preferred orientation of (111) and a blue shift of energy band gap at 2.35 eV. Quantitative calculation results indicated that the traditional bombardment effects of electrons and sputtering argon ions were both negligible during the bias deposition in the balanced MS system. Instead, a new model of tip charging effect was further proposed to account for the controllable formation of PNFs by the balanced bias sputtering deposition.

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“…Among them, there is a special kind of porous films which is composed by plenty of solid and/or hollow nanostructures (e.g., nanoparticles, nanoligaments, nanowires, nanoplates, nanocavities, nanopores or nanochannels) and exhibits a distinctive structure of porous nanostructured films or porous nanostructure-films (PNFs for short). Due to the unique PNF structure along with the increased film porosity and surface area, it is expected that such PNFs may have improved or enhanced performance in contrast to the traditional porous thin films and solid thin films [8,9]. However, since the building nanostructures are highly curved and limited in space within nanoscale, the surface energy is dramatically increased [10,11] and will cause an intrinsic structural or physical instability in the PNFs.…”

Section: Introductionmentioning

confidence: 99%

Nanoinstabilities of Cu₂O porous nanostructured films as driven by nanocurvature effect and thermal activation effect

Zhu

et al. 2019

Nanotechnology

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In this work, the instabilities at the nanoscale (i.e. nanoinstabilities) of triangular pyramids-like Cu2O porous nanostructured films (PNFs) are studied by heating treatments under different atmosphere and temperature. It is found that the nanoscale building triangular-pyramids turn round preferentially at the sharp angles and/or coalesce with their contacting ones by directional diffusion and plastic flow of atoms, which are driven by the nonuniformly-distributed surface nanocurvature. As a result, the triangular pyramids become quasi-sphere shape and the PNF evolves into a big, dense particles film. It is also observed that the heating or thermal activation effect efficiently promotes the reduction or oxidation of Cu2O pyramids and the crystallization or growth of the as-achieved Cu or CuO grains. The above physical and chemical instabilities or changes at the nanoscale of Cu2O PNFs can be well accounted for by the combined mechanism of nanocurvature effect and thermal activation effect. The nanocurvature effect can lower the energy barrier for the atom diffusion or plastic flow and lower the activation energy for the chemical reactions, while the thermal activation effect can supply the required kinetic energy or activation energy and make the atomic transportations and reactions kinetically possible. The findings reveal the evolution laws of morphology, crystal structure and composition of triangular pyramids-like Cu2O PNF during heating treatments, which can further be extended to other types of Cu2O PNFs. Also, the findings have important implications for the nanoinstabilities of Cu2O 2 PNFs-based devices, especially those working at a high temperature.

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Microstructure-dependent oxidation-assisted dealloying of Cu0.7Al0.3 thin films

Cited by 7 publications

References 15 publications

Selective bias deposition of CuO thin film on unpolished Si wafer

Selective bias deposition of CuO thin film on unpolished Si wafer

Cu₂O porous nanostructured films fabricated by positive bias sputtering deposition

Nanoinstabilities of Cu₂O porous nanostructured films as driven by nanocurvature effect and thermal activation effect

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Microstructure-dependent oxidation-assisted dealloying of Cu0.7Al0.3 thin films

Cited by 7 publications

References 15 publications

Selective bias deposition of CuO thin film on unpolished Si wafer

Selective bias deposition of CuO thin film on unpolished Si wafer

Cu2O porous nanostructured films fabricated by positive bias sputtering deposition

Nanoinstabilities of Cu2O porous nanostructured films as driven by nanocurvature effect and thermal activation effect

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Product

Resources

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Cu₂O porous nanostructured films fabricated by positive bias sputtering deposition

Nanoinstabilities of Cu₂O porous nanostructured films as driven by nanocurvature effect and thermal activation effect