Microstructure-dependent etching behavior of a partially recrystallized Invar alloy

Park, Sung Jin; Jo, Seong-Hyeon; Oh, Sehyeok; Oh, Youngseok; Kim, Se Jong; Lee, Ho Won; Kang, Seong-Hoon; Moon, Young Hoon; Jung, Jaimyun

doi:10.1016/j.matdes.2022.110631

Cited by 7 publications

(2 citation statements)

References 38 publications

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“…Liu et al studied the effect of heat input on the weld microstructure and properties in the keyhole welding of the Invar alloy using high-energy synchrotron X-ray diffraction and impact testing, finding that the grain size and texture changed significantly with the selected heat input in the fusion zone [ 6 ]. Park et al studied the microstructure-dependent etching behavior of a partially recrystallized Invar alloy and found that surface energy, geometrically necessary dislocations, and grain boundary density were directly proportional to the etching rate [ 7 ]. Sonomura et al studied the Invar alloy metallization of the Al 2 O 3 substrate via friction stirring and examined the potential of the friction stirring surface treatment for the Invar alloy’s metallization [ 8 ].…”

Section: Introductionmentioning

confidence: 99%

Rapid Solidification of Invar Alloy

He,

Yao,

et al. 2023

Materials

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The Invar alloy has excellent properties, such as a low coefficient of thermal expansion, but there are few reports about the rapid solidification of this alloy. In this study, Invar alloy solidification at different undercooling (ΔT) was investigated via glass melt-flux techniques. The sample with the highest undercooling of ΔT = 231 K (recalescence height 140 K) was obtained. The thermal history curve, microstructure, hardness, grain number, and sample density of the alloy were analyzed. The results show that with the increase in solidification undercooling, the XRD peak of the sample shifted to the left, indicating that the lattice constant increased and the solid solubility increased. As the solidification of undercooling increases, the microstructure changes from large dendrites to small columnar grains and then to fine equiaxed grains. At the same time, the number of grains also increases with the increase in the undercooling. The hardness of the sample increases with increasing undercooling. If ΔT ≥ 181 K (128 K), the grain number and the hardness do not increase with undercooling.

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Section: Introductionmentioning

confidence: 99%

Rapid Solidification of Invar Alloy

He,

Yao,

et al. 2023

Materials

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“…5 Generally, to obtain a higher resolution from an OLED display, the thickness of the Invar alloy film must be thinner. 6 For rolled Invar alloy film, it was difficult to obtain higher resolution than quarter high definition (QHD) because the thickness was difficult to reduce. 7,8 Compared with other fabrication techniques for Invar alloy films, the electrodeposition method was simple and less expensive.…”

mentioning

confidence: 99%

Fabrication of Large-Sized Invar Alloy Film with Low Thermal Expansion by Pulse Reverse Electrodeposition

Yu,

Zhong,

et al. 2023

J. Electrochem. Soc.

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Invar alloy film with low thermal expansion is a key substrate for high-resolution organic light-emitting diodes (OLEDs). The preparation of Invar alloy film by electrodeposition has attracted increasing attention due to its low cost and simple process. In this work, a large-sized (8×10 cm) uniform Fe-Ni alloy film was fabricated by pulse reverse electrodeposition. The effects of the electrodeposition parameters on the chemical composition and microstructure of Fe-Ni alloy films were investigated. Results showed that greater Ni2+/Fe2+ in the electrolyte, lower pulse frequency (f), smaller reverse pulse coefficient (x), and lower electrodeposition temperature (T) favored the iron content. The Invar alloy film (64 wt.% Fe) was electrodeposited at T = 50°C, x = 0.2, f = 10 Hz, and Ni2+/Fe2+ = 1.9 when the average pulse current density was 30 mA/cm2. The structure of the film was composed of a mixture of fcc and bcc phases, where (110) and (111) preferential orientations were predominant. After heat treatment in H2 at 800°C for 120 min, the bcc phase transformed into the fcc phase, and the grain size increased (>2 μm). As a result, the coefficient of thermal expansion of the film decreased from 11×10-6 to 1.5×10-6/°C, which is close to the standard for commercial application

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Controlled Stepwise Wet Etching of Polycrystalline Mo Nanowires

Saidov,

Erofeev,

Aabdin

et al. 2023

Adv Funct Materials

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With the persistent downscaling of integrated circuits, molybdenum (Mo) is currently considered a potential replacement for copper (Cu) as a material for metal interconnects. However, fabricating metal nanostructures with critical dimensions of the order of 10 nm and below is challenging. This is because the very high density of grain boundaries (GBs) results in highly non‐uniform surface profiles during direct wet etching. Moreover, wet etching of Mo with conventional aqueous solutions is problematic, as products of Mo oxidation have different solubility in water, which leads to increased surface roughness. Here, a process is shown for achieving a stable and uniform soluble surface layer of Mo oxide by wet oxidation with H2O2 dissolved in IPA at −20 °C. The oxide layer is then selectively dissolved, and by repeating the oxidation and dissolution multiple times, a uniform etch profile is demonstrated with a fine control over the metal recess. Ultimately, this presents a method of precise and uniform wet etching for Mo and other metals needed to fabricate complex nanostructures that are critical in developing next‐generation electronic devices.

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Microstructure-dependent etching behavior of a partially recrystallized Invar alloy

Cited by 7 publications

References 38 publications

Rapid Solidification of Invar Alloy

Rapid Solidification of Invar Alloy

Fabrication of Large-Sized Invar Alloy Film with Low Thermal Expansion by Pulse Reverse Electrodeposition

Controlled Stepwise Wet Etching of Polycrystalline Mo Nanowires

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