Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies

Snugovsky, Polina; McCormick, H.; Bagheri, S.; Bagheri, Zohreh; Hamilton, C. H.; Romansky, Marianne

doi:10.1007/s11664-008-0592-3

Cited by 20 publications

(11 citation statements)

References 3 publications

(3 reference statements)

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“…For larger BGA packages with long life requirements, complete solder mixing is not necessary. Snugovsky et al's findings [78] also agreed with the iNEMI results and further suggested that mixed reliability is sensitive to microstructure, which is sensitive to processing conditions and alloy composition. Coyle et al [65] performed a thermal cycling reliability comparison (0/100°C) between partially mixed (minimum 70%) and fully mixed assemblies (100%) for 21 mm BGAs (pitch size: 1 mm, ball diameter: 0.63 mm).…”

Section: Figure 3 Reflow Process Guidelines [66]supporting

confidence: 58%

“…The reliability of mixed solder interconnects under thermal cycling conditions is related to the degree of Pb mixing and the formation of microstructures within the solders [77]. Completely mixed solder interconnects with Pb uniformly distributed throughout the microstructures and partially mixed joint showed their fatigue life was comparable with that of pure SnPb and Pb-free solder interconnects.…”

Section: Figure 3 Reflow Process Guidelines [66]mentioning

confidence: 99%

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Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

et al. 2020

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Due to safety and reliability concerns, various classes and/or applications of electronic products are excluded from the European Union's Restriction of Hazardous Substances (RoHS) regulations requiring the elimination of lead (Pb). However, the majority of electronic devices are now Pb-free. As a result, manufacturers attempting to maintain tin-lead (SnPb) based electronics face an increasing challenge to procure parts and products with Pb-based solder. This paper reviews the challenges of producing Pbbased electronic equipment, the reliability concerns with Pb-free electronics, and the options that manufacturers have for maintaining reliable, Pb-based production. In particular, the paper examines mixed soldering processes and the re-balling of Pb-free electronic parts. While Pb-free electronics present risks, it is our conclusion that the risks are manageable and are lower than those incurred by maintaining an increasingly obsolete Pb-based manufacturing process.

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Section: Figure 3 Reflow Process Guidelines [66]supporting

confidence: 58%

Section: Figure 3 Reflow Process Guidelines [66]mentioning

confidence: 99%

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

et al. 2020

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“…Researchers and electronic packaging manufactures have embarked on a series of studies on such crucial properties as particle size distribution, oxidation resistance as well as flux type, in order to improve the manufacture and reliability of solder pastes [4][5][6][7][8][9][10]. In particular, study on the surface oxidation is the key issue since oxidation not only wastes solder, but also results in poor solderability, which reduces the reliability of solder joints [2,4,6,11].…”

Section: Introductionmentioning

confidence: 99%

Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

Zhang

Wang

2009

Journal of Alloys and Compounds

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“…The determining factor in a reliability analysis may a small component that is hard to find and a failure that is difficult to see (Snugovsky et al, 2008). PTHs are integral to PCBs and are difficult to track once they are manufactured.…”

Section: Discussionmentioning

confidence: 99%

Modeling of plated through hole reliability and performance

Sharon

Barker

2011

Multidiscipline Modeling in Materials and Structures

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Purpose -The purpose of this paper is to evaluate modeling of the reliability characteristics of the copper (Cu) used in plated through holes (PTHs) for electrical connections across printed circuit boards (PCBs). Design/methodology/approach -Assessments of the Cu damage in the first three reflow cycles are performed using finite element analysis. A two-dimensional axi-symmetric model of a PTH on a laminate board is validated against a three-dimensional full model and test cases. Stress and strain measurements in the inner ring of the PTH are obtained in numerical simulations. Findings -Loads applied after the reflow cycles contribute to subsequent mechanical disconnects. Reliability assessments relying on undamaged circuits are less accurate than estimates incorporating Cu damage following three reflow cycles. Originality/value -In order to increase the accuracy of PCB reliability predictions significantly, prior-to-use damage should be calculated. In this paper, a modification to the reliability analysis is proposed.

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Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies

Cited by 20 publications

References 3 publications

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

Modeling of plated through hole reliability and performance

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