Microstructure characterization of W-Cu alloy sheets produced by high temperature and high pressure deformation technique

Chen, Wenge; Dong, Longlong; Zhou, Hui; Song, Jiulong; Deng, Nan; Wang, Jiaojiao

doi:10.1016/j.matlet.2017.06.090

Cited by 31 publications

(6 citation statements)

References 10 publications

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“…Therefore, W/Cu joining is key for the fabrication of plasma-facing compounds. However, it is difficult to join W to Cu directly because of their intrinsic immiscible nature, and the prominent difference in physical properties, such as the thermal expansion coefficient (α Cu ≈ 4α W ) and Young's modulus (E Cu ≈ 0.2E W ), which will cause severe thermal stress in the W/Cu joints at a high temperature [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface

Chen

et al. 2021

Metals

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W/Cu joining is key for the fabrication of plasma-facing compounds of fusion reactors. In this work, W and Cu are joined through three steps: (1) hydrothermal treatment and reduction annealing (i.e., nano-treatment), (2) Cu plating and annealing in a pure H2 atmosphere, and (3) W/Cu bonding at 980 °C for 3 h. After nano-treatment, nanosheets structure can be found on the W substrate surface. The tensile strength of the W/Cu joint prepared via nano-treatment reaches as high as approximately 93 MPa, which increases by about 60% compared with the one without nano-treatment. The microhardness curves exhibited continuous variations along the W/Cu interface. The TEM images show that the W/Cu interface is compact without any cracks or voids. This work may also be applied for enhancing bonding strength in other immiscible materials.

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Section: Introductionmentioning

confidence: 99%

The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface

Chen

et al. 2021

Metals

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“…Tungsten-copper (W-Cu) laminated composites, due to the high melting point, high sputtering resistance and low tritium retention property of W and the good thermal conductivity of Cu, have been widely used in many fields, such as plasma facing materials (PFMs), high temperature resistant materials, microelectronic materials and packaging materials [1][2][3]. However, as a typical immiscible binary metal system, the heat of formation for the W-Cu system (∆Hf = +33 kJmol −1 ) [4] is positive, which means that direct alloying between W and Cu is very difficult.…”

Section: Introductionmentioning

confidence: 99%

Construction of an n-Body Potential for Revealing the Atomic Mechanism for Direct Alloying of Immiscible Tungsten and Copper

Zeng

Huang

2021

Materials

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W-Cu laminated composites are critical materials used to construct nuclear fusion reactors, and it is very important to obtain direct alloying between W and Cu at the W/Cu interfaces of the composites. Our previous experimental studies showed that it is possible to overcome the immiscibility between W and Cu and obtain direct alloying when the alloying temperature is close to the melting point of Cu. Because the W-Cu interatomic potentials published thus far cannot accurately reproduce the alloying behaviors of immiscible W and Cu, an interatomic potential suitable for the W-Cu system has been constructed in the present study. Based on this potential, direct alloying between W and Cu at high temperature has been verified, and the corresponding diffusion mechanism has been studied, through molecular dynamics (MD) simulations. The results indicate that the formation of an amorphous Cu layer at the W/Cu interface plays a critical role in alloying because it allows Cu atoms to diffuse into W. The simulation results for direct alloying between W and Cu can be verified by experimental results and transmission electron microscopy observations. This indicates that the constructed W-Cu potential can correctly model the high-temperature performance of the W-Cu system and the diffusion mechanism of direct alloying between W and Cu.

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“…In the selection of the matrix alloy, copper alloy has the characteristics of high density and high strength, tungsten copper composites have been successfully applied in many industrial fields, and the preparation technology is relatively mature. Therefore, copper alloy was selected as the matrix of composites in this study [ 21 , 22 , 23 , 24 , 25 ]. To improve the interfacial bonding strength, iron, nickel, and aluminum were added to copper to increase the interfacial strength.…”

Section: Introductionmentioning

confidence: 99%

Microstructure Evolution Mechanism of Wf/Cu82Al10Fe4Ni4 Composites under Dynamic Compression at Different Temperatures and Strain Rates

Zhang

Jiang

et al. 2021

Materials

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Wf/Cu82Al10Fe4Ni4 composites were fabricated by the pressure infiltration method. The composites were compressed by means of a split Hopkinson pressure bar (SHPB) with strain rates of 800 and 1600 s−1 at different temperatures. The microstructure of the composites after dynamic compressing was analyzed by transmission electron microscopy (TEM). Observation revealed that there were high-density dislocations, stacking faults, twins, and recrystallization existing in the copper alloy matrix of the composites. High-density dislocations, stacking faults, and twins were generated due to the significant plastic deformation of the copper alloy matrix under dynamic load impact. We also found that the precipitated phase of the matrix played a role in the second phase strengthening; recrystallized microstructures of copper alloy were generated due to dynamic recrystallization of the copper alloy matrix under dynamic compression at high temperatures.

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Microstructure characterization of W-Cu alloy sheets produced by high temperature and high pressure deformation technique

Cited by 31 publications

References 10 publications

The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface

The Improvement of Bonding Strength of W/Cu Joints via Nano-Treatment of the W Surface

Construction of an n-Body Potential for Revealing the Atomic Mechanism for Direct Alloying of Immiscible Tungsten and Copper

Microstructure Evolution Mechanism of Wf/Cu82Al10Fe4Ni4 Composites under Dynamic Compression at Different Temperatures and Strain Rates

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