Microstructure and XRD analysis of brazing joint for duplex stainless steel using a Ni–Si–B filler metal

Yuan, Xinjian; Kang, Chung Yun; Kim, Myung Bok

doi:10.1016/j.matchar.2009.03.004

Cited by 61 publications

(34 citation statements)

References 25 publications

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“…SEM images and XRD patterns then were recorded, the results of which are shown in Figures 9 and 10. Figure 10 confirms the existence of BN and (Cr, Ni) 3 Si in bonded interlayer. Therefore, it could be concluded that the resultant microstructure of the remaining melt contained BN and (Cr, Ni) 3 Si rich in N.…”

Section: Methodssupporting

confidence: 59%

“…Figure 3 shows typical cross-sectional SEM images of the joint for DSS using MBF-30 prepared at 1333.15 K (1060°C) for 60 seconds. Figure 3 shows that the joint region consisted of the following distinct microstructural zones, prior to completion of isothermal solidification: [3] (a) Isothermally solidified zone (ISZ), which consisted of a proeutectic c-Ni solid solution phase. Some Ni 3 Si precipitates with granular morphology were present in the ISZ adjacent to the remaining melt as shown in Figure 3(b).…”

Section: Methodsmentioning

confidence: 99%

“…[1][2][3][4][5] The TLP bonding developed by Duvall et al [6] is a hybrid joining process, which combines the beneficial features of liquid phase joining and diffusion bonding techniques. [7] In the TLP bonding process, an insert alloy containing melting point depressant elements is sandwiched between the base alloy surfaces, and then the assembly is heated to a temperature between the liquidus of the insert metal and that of the base metal.…”

Section: Introductionmentioning

confidence: 99%

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Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Yuan

Kim

Kang

2010

Metall Mater Trans A

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Microstructural evolution and bonding behavior of transient liquid-phase (TLP) bonded joint for a duplex stainless steel using MBF-30 (Ni-4.5Si-3.2B [wt pct]) and MBF-50 (Ni-7.5Si-1.4B-18.5Cr [wt pct]) were investigated. Using MBF-30, the microstructure of the athermally solidified zone was dependent on B diffusion at 1333.15 K (1060°C). Ni 3 B and a supersaturated c-Ni phase were observed in this zone. BN appeared in the bonding-affected zone. However, using MBF-50, the influences of base metal alloying elements, particularly N and Cr as well as Si in the filler material, on the bond microstructure development were more pronounced at 1448.15 K (1175°C). BN and (Cr, Ni) 3 Si phase were present in the bond centerline. The formation of BN precipitates in the bonding-affected zone was suppressed. A significant deviation in the isothermal solidification rate from the conventional TLP bonding diffusion models was observed in the joints prepared at 1448.15 K (1175°C) using MBF-50.

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Section: Methodssupporting

confidence: 59%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Yuan

Kim

Kang

2010

Metall Mater Trans A

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“…For this application, Ni-B and Ni-B-Si alloys are remarkable, though they are also of interest to other important research fields. These alloys have been studied in view of such applications as bulk glassy alloys [5][6][7] soft magnetic materials [8], or brazing filler alloys [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Phase Selection during Solidification of Ni-10.95 at. % and B-3.23 at. % Si Alloy

Fraga-Chávez

Castro‐Román

Herrera-Trejo

et al. 2017

Metals

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Abstract:To gain insight into the solidification of the Ni-10.95 at. % and B-3.23 at. % Si alloy, 29 cast samples extracted from a casting of this alloy were remelted under an Ar atmosphere, using either DSC or an in-house thermal analysis apparatus. Ni(fcc) and Ni 3 B phases were identified by X-ray diffraction of both the remelted and original cast samples; however, microstructural differences were observed between the two. These microstructural differences are associated with the high undercooling observed during the eutectic reaction in the remelted samples. This high undercooling results from the difficulty of Ni 3 B nucleation, which allows the formation of a Ni x B y metastable phase. Metallographic inspection shows that the metastable phase solidifies at least partially through a non-cooperative growth mechanism. This metastable phase may be the elusive Ni 23 B 6 phase. The melting temperature of the metastable phase is 985 • C, and it solidifies below 943 • C under the experimental conditions used in this study. The temperature of solid transformation of the metastable constituent to Ni 3 B and Ni is strongly dependent on the amount of Ni 3 B formed during solidification. The minimal temperature of such transformation, 834 • C, corresponds to samples where Ni 3 B solidification was not detected in the thermal curves.

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“…Na brasagem em alta temperatura é comum observar interdifusão de elementos de liga entre o metal de base e o metal de adição fundido, especialmente os elementos depressores da temperatura liquidus [59]. A profundidade de enriquecimento de elementos provenientes do metal de adição fundido, a partir da interface entre o metal de base e o metal de adição em um tempo constante, será consequência direta da temperatura de brasagem.…”

Section: Efeito Da Temperaturaunclassified

Análise microestrutural de junta brasada de aço inoxidável duplex UNS S32101, UNS S32304, UNS S32750 e UNS S32707 com metal de adição a base de níquel.

Centeno¹,

Michell²

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iii Este exemplar foi revisado e corrigido em relação à versão original, sob responsabilidade única do autor e com a anuência de seu orientador. Ao meu orientador, prof. Dr. Sérgio Duarte Brandi, pela generosidade, paciência e constante ajuda oferecida durante todo este tempo.A minha adorada mãe, Laura Centeno Calderón, que sempre me mostrou que nossa maior fortaleza vem dos nossos sacrifícios e conquistas.Aos meus queridos irmãos, Sheyla e Erik, por nunca deixar de acreditar em mim, pois sua confiança me enche de coragem a cada dia.A meu avô, Augusto Centeno Paredes, por segurar minha mão durante tanto tempo.Aos meus tios, Jilmar e Vladimiro Centeno, por me ensinar a enfrentar qualquer dificuldade sem temor de fracasso.A Clelia Rodrigues pela compreensão, amor e companheirismo.

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Microstructure and XRD analysis of brazing joint for duplex stainless steel using a Ni–Si–B filler metal

Cited by 61 publications

References 25 publications

Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Phase Selection during Solidification of Ni-10.95 at. % and B-3.23 at. % Si Alloy

Análise microestrutural de junta brasada de aço inoxidável duplex UNS S32101, UNS S32304, UNS S32750 e UNS S32707 com metal de adição a base de níquel.

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