Microstructure and Texture Evolution in Cold‐Rolled and Annealed Oxygen‐Free Copper Sheets
Jing Qin,
Xun Li,
Dongsheng Wang
et al.
Abstract:The commercial oxygen-free copper sheets were cold-rolled with reduction rates ranging from 20% to 87% reduction rate and annealed at 400, 500 and 600 °C. The microstructure and texture evolution during cold-rolling and annealing processes were studied using optical microscopy (OM), the scanning electron microscopy (SEM) and the electron back-scattered diffraction (EBSD). The results show that the deformation textures of {123} (S) , {112} (Copper) and {110} (Brass) were continuously enhanced with the increase … Show more
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