Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages

Lee, Donghun; Jang, Jae-il; Kim, Young-Ho

doi:10.1007/s10854-022-08079-y

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Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages

Cited by 2 publications

References 21 publications

Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding

Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding

Interfacial Reaction of Cu/Sac105/Cu Solder Joints Reinforced with Ti Nanoparticles Under Vacuum Thermo-Compression Bonding

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