Microstructure and Properties of Porous Copper Foils with High Specific Surface Area Prepared by Electrodeposition

Jia, Ya-peng; Sun, Wan‐chang; Bai, Zhong-bo; Liu, Eryong; Du, Liangliang; Cheng, Hui; Zhang, Jingli; Peng, Xiaolin; Wang, Liping

doi:10.2139/ssrn.4412895

2023

DOI: 10.2139/ssrn.4412895

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Microstructure and Properties of Porous Copper Foils with High Specific Surface Area Prepared by Electrodeposition

Ya-peng Jia¹,

Wan‐chang Sun²,

Zhong-bo Bai³

et al.

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Microstructure and Properties of Porous Copper Foils with High Specific Surface Area Prepared by Electrodeposition

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