Microstructure and properties of Mo–Cu alloys produced by powder metallurgy

Wang, T. G.; Liang, Q. C.; Qin, Qun

doi:10.1179/1432891714z.0000000001267

Cited by 3 publications

(3 citation statements)

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Section: Introductionmentioning

confidence: 99%

“…This involves sintering Mo powders to make a porous pre-form which can then be infiltrated with molten Cu. This process is only viable in a limited composition range, and the rate of densification is low [12].Efforts to accelerate densification have mainly involved using ball milling to produce nanoscale Mo and Cu powders with high defect concentrations. These can then be densified more rapidly via powder compaction and sintering at 1000-1200 • C [12][13][14].…”

mentioning

confidence: 99%

“…This process is only viable in a limited composition range, and the rate of densification is low [12].Efforts to accelerate densification have mainly involved using ball milling to produce nanoscale Mo and Cu powders with high defect concentrations. These can then be densified more rapidly via powder compaction and sintering at 1000-1200 • C [12][13][14]. Although the ball-milled powders have grain sizes in the range of 10-20 nm, grain growth during sintering is rapid and the densified compacts have grain diameters of several microns [3,11,13].…”

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confidence: 99%

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On nanostructured molybdenum–copper composites produced by high-pressure torsion

et al. 2017

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Nanostructured molybdenum-copper composites have been produced through severe plastic deformation of liquid-metal infiltrated Cu30Mo70 and Cu50Mo50 (wt%) starting materials. Processing was carried out using highpressure torsion at room temperature with no subsequent sintering treatment, producing a porosity-free, ultrafine-grained composite. Extensive deformation of the Cu50Mo50 composite via two-step high-pressure torsion produced equiaxed nanoscale grains of Mo and Cu with a grain size of 10-15 nm. Identical treatment of Cu30Mo70 produced a ultrafine, lamellar structure, comprised of Cu and Mo layers with thicknesses of $ 5 and $ 10À20 nm, respectively, and an interlamellar spacing of 9 nm. This microstructure differs substantially from that of HPT-deformed Cu-Cr and Cu-W composites, in which the lamellar microstructure breaks down at high strains. The ultrafinegrained structure and absence of porosity resulted in composites with Vickers hardness values of 600 for Cu30Mo70 and 475 for Cu50Mo50. The ability to produce Cu30Mo70 nanocomposites with a combination of high-strength, and a fine, oriented microstructure should be of interest for thermoelectric applications.

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Section: Introductionmentioning

confidence: 99%

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confidence: 99%