2014
DOI: 10.1016/j.jeurceramsoc.2014.05.042
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Microstructure and properties of diamond/SiC composites prepared by tape-casting and chemical vapor infiltration process

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Cited by 48 publications
(14 citation statements)
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“…If the volume fraction of particles is fixed, it is easy to prove that the thermal conductivity of the composite is a monotonically increasing function of ܽ • ݄. Theoretically, the interfacial thermal conductance between matrix and second phase particles is related to the density and phonon velocity of the two materials [28]. Therefore, the interfacial thermal conductance between UO 2 and diamond is assumed to be a constant.…”
Section: Thermal Conductivitymentioning
confidence: 99%
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“…If the volume fraction of particles is fixed, it is easy to prove that the thermal conductivity of the composite is a monotonically increasing function of ܽ • ݄. Theoretically, the interfacial thermal conductance between matrix and second phase particles is related to the density and phonon velocity of the two materials [28]. Therefore, the interfacial thermal conductance between UO 2 and diamond is assumed to be a constant.…”
Section: Thermal Conductivitymentioning
confidence: 99%
“…Young's Modulus (GPa) diamond particle size (µm) Gatt et al,[28], 97.3% TD Padel and Novion., [29], 95.9%TD 93.8%TD Fig.10. Young's modulus of UO 2 -diamond composites as a function of mean particle size of diamond.…”
Section: Thermal Conductivitymentioning
confidence: 99%
“…The material consists of diamond and silicon carbide (SiC) crystals with complex spatial and size distributions of grains. Representative microstructures and processing routes for this material system can be found in [ 10 , 11 , 12 , 13 , 14 , 15 ]. In the material studied herein, disparities exist in typical grain sizes among the primary (diamond) and secondary (SiC) phases, with diamond grains tending to be at least an order of magnitude larger, with mean sizes in tens of microns.…”
Section: Introductionmentioning
confidence: 99%
“…In the past few decades, diamond particles have been applied as effective thermal fillers and reinforcement phases for ceramics and metal matrix materials due to their high strength and excellent thermal conductivity. The thermal conductivity and flexural strength of SiC ceramics can be obviously improved by introducing diamond particles . Diamond‐modified Cu and Cu alloy composites also exhibit enhanced thermal conductivity and are regarded as promising thermal management materials .…”
Section: Introductionmentioning
confidence: 99%