Microstructure and properties of Cu/Al joints brazed with Zn–Al filler metals

Feng, Ji; Xue, Songbai; Lou, Ji-yuan; Lou, Yin-bin; Shuiqing, Wang

doi:10.1016/s1003-6326(11)61172-2

Cited by 70 publications

(18 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…6. The two layers are observed at the interface, e (CuZn 4 ) and c (Cu 5 Zn 8 and Al 4 Cu 9 ), which grow as time increases. In the c layer, fast 5, the Gibbs free energy of the Al 4 Cu 9 phase is lower than that for the Cu 5 Zn 8 phase, and at lower temperatures this difference becomes more marked.…”

Section: Aging Of Jointsmentioning

confidence: 98%

“…The spreading areas of Zn-Al + Na alloys for spreading test at 500°C after 1,3,8,15,30, and 60 min of contact and at the temperatures of 475, 500, 525, and 550°C after 8 min are shown in Fig. 1(a) and (b), respectively.…”

Section: Reaction Of Solders With Substrate Interactionsmentioning

confidence: 99%

“…Therefore, flux QJ201 from powder, consisting of KCl 50 wt.%, LiCl 32 wt.%, NaF 10 wt.%, and ZnCl 2 8 wt.%, was applied for the purposes of protection and oxide removal. Wetting tests were performed after 1,3,8,15,30, and 60 min of contact, at the temperatures of 475, 500, 525, and 550°C. As described in Ref 2, the spreading area of 0.5 g samples of Zn-Al-Na solder was calculated after cleaning the flux residue from solidified samples.…”

Section: Introductionmentioning

confidence: 99%

“…Spreading tests were performed for 1,3,8,15, 30, and 60 min of contact, at the temperatures of 475, 500, 525, and 550°C. After cleaning the flux residue from solidified samples, the spreading area of Zn-Al + Na on Cu was determined in accordance with ISO 9455-10:2013-03.…”

mentioning

confidence: 99%

See 3 more Smart Citations

Interfacial Reactions of Zn-Al Alloys with Na Addition on Cu Substrate During Spreading Test and After Aging Treatments

Gancarz

Pstruś

Berent

2016

J. of Materi Eng and Perform

View full text Add to dashboard Cite

Spreading tests for Cu substrate with Zn-Al eutectic-based alloys with 0.2, 0.5, and 1.0 wt.% of Na were studied using the sessile drop method in the presence of QJ201 flux. Spreading tests were performed for 1,3,8,15, 30, and 60 min of contact, at the temperatures of 475, 500, 525, and 550°C. After cleaning the flux residue from solidified samples, the spreading area of Zn-Al + Na on Cu was determined in accordance with ISO 9455-10:2013-03. Selected, solidified solder-substrate couples were cross-sectioned and subjected to scanning electron microscopy of the interfacial microstructure. The experiment was designed to demonstrate the effect of Na addition on the kinetics of formation and growth of CuZn, Cu 5 Zn 8 , and CuZn 4 phases, which were identified using x-ray diffraction and energy-dispersive spectroscopy analysis. The addition of Na to eutectic Zn-Al caused the spreading area to decrease and the thickness of intermetallic compound layers at the interface to reduce. Samples after the spreading test at 500°C for 1 min were subjected to aging for 1, 10, and 30 days at 120,170, and 250°C. The greater thicknesses of IMC layers were obtained for a temperature of 250°C. With increasing Na content in Zn-Al + Na alloys, the thickness reduced, which correlates to the highest value of activation energy for Zn-Al with 1% Na.

show abstract

Section: Aging Of Jointsmentioning

confidence: 98%

Section: Reaction Of Solders With Substrate Interactionsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

See 2 more Smart Citations

Interfacial Reactions of Zn-Al Alloys with Na Addition on Cu Substrate During Spreading Test and After Aging Treatments

Gancarz

Pstruś

Berent

2016

J. of Materi Eng and Perform

View full text Add to dashboard Cite

show abstract

“…In previous investigations [10], the author studied the effect of Al content on the properties of Zn-Al filler metals and Cu/Al brazing joints. In present study, a serious of Zn-22Al alloy bearing trace amounts of Ce were used in creating the Cu and Al joint through automatic torch brazing.…”

Section: Introductionmentioning

confidence: 99%

Reliability studies of Cu/Al joints brazed with Zn–Al–Ce filler metals

2012

View full text Add to dashboard Cite

Microstructures and Properties of Aluminum–Copper Lap‐Welded Joints by Cold Metal Transfer Technology

et al. 2015

View full text Add to dashboard Cite

In this paper, 1 mm thick 1060 aluminum sheet and pure copper were joined using AlCu5 filler wire by cold metal transfer (CMT). It was found that it is feasible to join aluminum to copper by this method, and a good wettability and weld appearance was usually obtained. The effect of heat input on the microstructure and tensile shear strength of joints was investigated. The results indicated that a continuous layer of intermetallic compounds (IMCs), i.e., Al4Cu9 (g), Al2Cu3 (e), and Al2Cu (u) was produced in the Cu/weld interface, and the weld metal was composed of a-Al solid solutions and Al-Cu eutectic in the grain boundary. Additional heat input promoted the growth of the Al-Cu IMC layer, especially the Al2Cu layer. However, appropriate weld parameters resulted in a thinner IMC layer and improved the joint strength. The maximum load force reached 0.983 kN, and the joint fractured in the heat-affected zone of Al sheet with a ductile fracture mode.

show abstract

Microstructure and properties of Cu/Al joints brazed with Zn–Al filler metals

Cited by 70 publications

References 16 publications

Interfacial Reactions of Zn-Al Alloys with Na Addition on Cu Substrate During Spreading Test and After Aging Treatments

Interfacial Reactions of Zn-Al Alloys with Na Addition on Cu Substrate During Spreading Test and After Aging Treatments

Reliability studies of Cu/Al joints brazed with Zn–Al–Ce filler metals

Microstructures and Properties of Aluminum–Copper Lap‐Welded Joints by Cold Metal Transfer Technology

Contact Info

Product

Resources

About