2017
DOI: 10.1134/s0031918x1712016x
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Microstructure and Physicomechanical Properties of a Cu-8 at % Pd Alloy

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Cited by 13 publications
(2 citation statements)
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“…2. The small drop in resistivity occurs at the initial stage due to stress relieving through dislocation rearrangement of cold rolled alloys [25,26]. The foremost drop in resistivity is due to dissolve of GP zones followed the subsequent increase in resistivity is due to the appearance of formation of fine precipitates metastable phases [27,28].…”
Section: Isothermal Annealingmentioning
confidence: 99%
“…2. The small drop in resistivity occurs at the initial stage due to stress relieving through dislocation rearrangement of cold rolled alloys [25,26]. The foremost drop in resistivity is due to dissolve of GP zones followed the subsequent increase in resistivity is due to the appearance of formation of fine precipitates metastable phases [27,28].…”
Section: Isothermal Annealingmentioning
confidence: 99%
“…The formation of the CuPd-B2 phase is desired for its far better electrical properties compared to CuPd-A1 phase, which would improve the overall wire conductivity [12]. However, it is well known that the A1 -B2 transformation is very slow and need long-lasting high temperature annealing [13]. Best compromise in term of annealing is rather tedious to define as such a process would reduce lattice distortion to improve ductility, keep small grain size for high strength and form the largest fraction of B2 phase to improve electrical conductivity.…”
Section: Introductionmentioning
confidence: 99%