Microstructure and phase stability in a Nb–Mo–Cr–Al–Si alloy

Hu, Yan-Ling; Vasiliev, A. L.; Zhang, Lichun; Song, Kai; Aindow, Mark

doi:10.1007/s10853-008-3042-y

Cited by 7 publications

(6 citation statements)

References 61 publications

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“…Solidification of Sn-36 at.%Ni peritectic alloy was carried out with different growth rates (2,5,10,15,20,40 and 200 lm/s) at a constant temperature gradient (20 K/mm) in the Bridgman-type apparatus. With a predetermined growth distance of 30 mm reached, the samples were quickly quenched into liquid Ga-In-Sn alloy to preserve the microstructure.…”

Section: Methodsmentioning

confidence: 99%

“…If the dendrite microstructure is held in the mushy zone, coarsening sustained by the Gibbs-Thomson effect will occur [11][12][13][14][15][16][17], especially in alloys with larger freezing range. Because peritectic phase formed through peritectic reaction and transformation may change the solute transport between the secondary dendrite arms, coarsening will also be influenced by peritectic reaction during solidification of peritectic alloys.…”

Section: Introductionmentioning

confidence: 99%

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Effect of peritectic reaction on dendrite coarsening in directionally solidified Sn–36 at.%Ni alloy

Peng

et al. 2012

J Mater Sci

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Effect of peritectic reaction on dendrite coarsening was investigated in directionally solidified Sn-36 at.%Ni peritectic alloys at different growth rates (2*200 lm/s) under constant temperature gradient. A coarsening model was used to characterize the coarsening process in terms of both the secondary dendrite arm spacing (k 2 ) of the primary Ni 3 Sn 2 phase and the specific surface area (S V ) of dendrites. It was shown that peritectic reaction could retard the increase of k 2 and decrease of S V during coarsening, which resulted from decelerating solute transport rate between adjacent dendrite arms caused by the peritectic phase enclosing the primary phase. The kinetics of the peritectic reaction that was found to be crucial to determine the coarsening process was characterized by the reaction constant (f) which not only changed with growth rates but also with solidification time in the real solidification process at a given growth rate.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of peritectic reaction on dendrite coarsening in directionally solidified Sn–36 at.%Ni alloy

Peng

et al. 2012

J Mater Sci

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“…5 There have been several studies of the patterning of Co/ Pt and similar materials using different techniques including: deposition onto patterned resist, 6 ion beam patterning using stencil masks, 7 focused ion beam patterning, 8 and the deposition onto prepatterned substrates. 9 The latter technique has produced the best results, with 30 nm diameter magnetic islands with a periodicity of 60 nm. It does, however, suffer from the drawback of sidewall deposition which could introduce coupling between the dots and the trench.…”

Section: Introductionmentioning

confidence: 99%

High resolution magnetic force microscopy study of e-beam lithography patterned Co∕Pt nanodots

Belle

Schedin

Pilet

et al. 2007

Journal of Applied Physics

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E-beam lithography has been used to pattern a continuous Co∕Pt multilayer film with perpendicular anisotropy into circular islands of various sizes down to 25nm diameter on a 60nm pitch. High resolution magnetic force microscopy with in situ applied field has been used to directly determine the switching field distribution (SFD) and hysteresis loop of the islands. For the smallest islands, the coercivity is reduced and the width of the SFD is increased, indicating that they would not be well suited to data storage applications.

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“…Nanoimprint lithography ͑NIL͒ has emerged as a promising technique for patterning magnetic nanostructures which is capable of nanometer resolution and scalability. [6][7][8][9][10] In NIL, a resist is patterned by physical deformation with a mold assisted by either thermal effects or UV radiation. Magnetic nanostructures can then be fabricated by using the resist as a deposition template or as an etch mask.…”

Section: Introductionmentioning

confidence: 99%