With the vigorous development of miniaturization, a series of microsystem technologies emerge and play an increasingly paramount role. The demand for microcomponents such as microgears, microreactors, micromedical devices, and microfluidic devices is also increasing rapidly. [1][2][3] These microcomponents exhibit great potential for applications in aeronautics, automotive, consumer electronics, chemical, environmental analysis, and medical technology. [4,5] The development of microsystem technology requires components with sizes or features in the micrometer range. Existing manufacturing processes, such as microlaser ablation and lithographic process, are limited in terms of yield and/or materials. In addition, the traditional machining technology has the problem of low production efficiency and silicon etching has the problem of high cost. [6][7][8] Micro-metal injection molding (micro-MIM), rapidly developed from MIM, is a net or near-net manufacturing technology for preparing 3D complex metal parts, which can meet the requirements of microsystem technology. [9] It completely meets the requirement of high-cost performance and becomes the most potential preparation technology for the mass production of microworkpieces. [10] The major processing steps in micro-MIM technology are similar to MIM, which include the preparation of feedstock by mixing a thermoplastic binder with metal powder, injection molding into the required shape, and debinding to remove the binder system and sintering. [11] However, some injection molding requirements for micro-MIM are different from those used for MIM. To facilitate the manufacture of microstructure, the powder particle size must be fine enough. The specific surface area of fine powder is increased, and the binder with low viscosity but sufficient strength is needed to facilitate the microinjection molding and avoid the damage of green parts during demolding. At the same time, because the microinjection molding cavity is micron, it puts forward higher requirements for the