Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

Li, Shengli; Liu, Yang; Zhang, Hao; Cai, Hongming; Sun, Fenglian; Zhang, Guoqi

doi:10.1016/j.rinp.2018.10.005

Cited by 23 publications

(6 citation statements)

References 20 publications

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“…The Cu 3 Sn IMC layer in the as reflowed joint was thin and was not visible due to the resolution limit of the SEM. The observed microstructure agrees with those widely reported in soldering literature [23,24].…”

Section: Resultssupporting

confidence: 91%

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

et al. 2022

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The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro- and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.

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Section: Resultssupporting

confidence: 91%

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

et al. 2022

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“…Up to now, graphene has been introduced into many alloy systems to obtain composite materials and improve mechanical properties of alloy. It also brings structural reinforcements as a filler [23][24][25][26][27]. Liu et al reported add-on benefits of graphene nanosheets to the properties of a SnAgCu solder alloy.…”

Section: Introductionmentioning

confidence: 99%

AgCuTi/graphene-reinforced Cu foam: A novel filler to braze ZrB2-SiC ceramic to Inconel 600 alloy

Wang

Cai

Wang³

et al. 2020

Ceramics International

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In order to relieve high residual stresses between ceramics and metals during brazing processes, an AgCuTi/graphene-reinforced Cu foam composite filler was developed and used to braze the ZrB2-SiC ceramic and Inconel 600 alloy.Microstructures and shear strengths of the joints were systematically studied. The joints are composed of TiFe2, TiCu, TiC, Cu(s, s), Ag(s, s), and Ti5Si3 phases. It is found the addition of graphene on the Cu foam surface can effectively retard diffusions of metal atoms and avoid the collapse of the foam matrix. After being brazed at 900 o C, the joint can get a maximum shear strength of 157 MPa, much higher than those brazed without graphene addition. The high shear strength was investigated in detail and attributed to the integrity of the Cu foam, formation of the TiC and thickness of the reaction layer at the ceramic side.

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“…The microstructure of SAC305 solder joint consisted of primary b-Sn phase and the eutectic phase which contained the b-Sn phase with the distribution of very fine Ag 3 Sn IMC particles and needle-like Cu 6 Sn 5 IMC. 26,27 Additionally, Figure 5 shows the FESEM micrograph with the EDX mapping of SAC305 with the incorporation of 0.04 wt% CNT. From the EDX mapping, CNT represents by the carbon element was observed distributed uniformly across the solder matrix.…”

Section: Resultsmentioning

confidence: 99%

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Ismail

Jalar

Atiqah

et al. 2021

Nanomaterials and Nanotechnology

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The main objective of this study is to investigate the electrical properties of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotube instead of solder bulk. Sn–3.0Ag–0.5Cu solder paste with the incorporation of carbon nanotube up to 0.04 wt% was fabricated by using mechanical mixing method. Fabricated solder pastes were then soldered on printed circuit board via reflow soldering at 260°C peak temperature. Electrical resistivity of Sn–3.0Ag–0.5Cu-carbon nanotube solder joints was measured by the four-point probe method at room temperature. Microstructure properties were observed by optical microscope and field emission scanning electron microscope. Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint was found to increase with the incorporation carbon nanotube up to 0.03 wt% and slightly decrease at 0.04 wt%. Incorporation of carbon nanotube in the solder matrix apparently changes the microstructure of Sn–Ag–Cu solder alloys. Microstructural observation found that electrical resistivity correlated with the distribution area of eutectic phase in the solder matrix due to the existence of carbon nanotube. It was revealed that eutectic phase area increases with the increasing of carbon nanotube wt% up to 0.03 and then slightly decreases at the incorporation of 0.04 wt% carbon nanotube as parallel with the trend of electrical resistivity values.

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Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

Cited by 23 publications

References 20 publications

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

AgCuTi/graphene-reinforced Cu foam: A novel filler to braze ZrB2-SiC ceramic to Inconel 600 alloy

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

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