2012
DOI: 10.1016/j.msea.2012.02.038
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Microstructure and damping behaviour of consolidated magnesium chips

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Cited by 22 publications
(17 citation statements)
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“…Dislocation density can be quite significant at the interface and it increases with increasing Sm 2 O 3 content. For magnesium-based materials, increased dislocations are favorable for the damping enhancement as dislocation pinning contributes to the damping behavior of magnesium nanocomposites [46]. The increase in dislocation density can also be attributed to the presence of hard Sm 2 O 3 NPs in the magnesium matrix [47].…”
Section: Elastic Modulus and Damping Characteristicsmentioning
confidence: 99%
“…Dislocation density can be quite significant at the interface and it increases with increasing Sm 2 O 3 content. For magnesium-based materials, increased dislocations are favorable for the damping enhancement as dislocation pinning contributes to the damping behavior of magnesium nanocomposites [46]. The increase in dislocation density can also be attributed to the presence of hard Sm 2 O 3 NPs in the magnesium matrix [47].…”
Section: Elastic Modulus and Damping Characteristicsmentioning
confidence: 99%
“…A great majority of studies on this topic have focussed on recycling machining swarf into cylindrical bars [3][4][5][6][7][8][9][10][11][12] or rectangular bars [13][14][15], using hot/warm forward extrusion. In addition, recycling processes based on other SPD methods such as cyclic extrusion compression (CEC) [16], equal channel angular pressing (ECAP) [17][18][19], high-pressure torsion (HPT) [20] or compressive torsion [21], and combined use of forward extrusion and ECAP [22,23] have also been reported.…”
Section: Introductionmentioning
confidence: 99%
“…Increase in grain size was more in AE material ($ 3 times) with the increase in extrusion temperature from 250 1C to 400 1C compared to CCE ($ 2 times). This is mainly because of higher grain refinement in chip consolidated materials [13] and could be attributed to grain growth suppression at chip boundaries [17]. Table 1 clearly shows that under all extrusion conditions CCE materials exhibit higher UTS and 0.2% TPS compared to AE materials.…”
Section: Microstructurementioning
confidence: 94%