Microstructure and characterization of a novel cobalt coating prepared by cathode plasma electrolytic deposition

Quan, Cong; He, Yedong

doi:10.1016/j.apsusc.2015.07.080

Cited by 32 publications

(5 citation statements)

References 52 publications

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“…Based on the obtained results, the j-U characteristics are divided into four different stages; stage A (50-350 V), stage B (400 V), stage C (400-500 V), and stage D (500-600 V). [61][62][63] In stage A, the current density increases as a function of the applied voltage, which complies with Ohm's law and Faraday's law of electrolysis. During this stage, the evolution of the gaseous envelope was observed around the electrode/electrolyte interface, and the intensity of the gaseous envelope gradually increased with increasing the voltage, as shown in Figure 2b.…”

Section: J-u Characteristicssupporting

confidence: 70%

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

Menezes

Elnagar

Al-Shakran

et al. 2021

Adv Funct Materials

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A robust and efficient route to modify the chemical and physical properties of polycrystalline copper (Cu) wires via versatile plasma electrolysis is presented. Silica (SiO 2 ) nanoparticles (11 nm) are introduced during the electrolysis to tailor the surface structure of the Cu electrode. The influence of these SiO 2 nanoparticles on the structure of the Cu electrodes during plasma electrolysis over a wide array of applied voltages and processing time is investigated systematically. Homogeneously distributed 3D coral-like microstructures are observed by scanning electron microscopy on the Cu surface after the in-liquid plasma treatment. These 3D microstructures grow with increasing plasma processing time. Interestingly, the microstructured copper electrode is composed of CuO as a thin outer layer and a significant amount of inner Cu 2 O. Furthermore, the oxide film thickness (between 1 and 70 µm), the surface morphology, and the chemical composition can be tuned by controlling the plasma parameters. Remarkably, the fabricated microstructures can be transformed to nanospheres assembled in coral-like microstructures by a simple electrochemical treatment.

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Section: J-u Characteristicssupporting

confidence: 70%

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

Menezes

Elnagar

Al-Shakran

et al. 2021

Adv Funct Materials

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“…Co-based thin films have attracted much attention over the past several decades due in part to their interesting magnetic, 1-3 mechanical, [4][5][6] and catalytic properties. [7][8][9][10] More recently, Co has made inroads in microelectronics, specifically on-chip metallization, serving as a capping layer for Cu to suppress electromigration.…”

mentioning

confidence: 99%

In-Situ Stress Measurements during Cobalt Electrodeposition

Graciano

Bertocci

Stafford

2019

J. Electrochem. Soc.

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In situ cantilever curvature is used to quantify the growth stress in Co thin films, electrodeposited from an electrolyte consisting of 0.5 mol/L Na 2 SO 4 , 0.5 mol/L H 3 BO 3 , and 0.1 mol/L CoSO 4 • 7 H 2 0. The average biaxial steady-state stress is measured as a function of the deposition potential and is examined as a function of growth rate. Stresses as low as +85 MPa (tensile) are obtained at small growth rate, increasing to a limiting value of 800 MPa as the growth rate is increased. The data is fit to a kinetic model that appears in the literature and treats the stress as a dynamic competition between coalescence-induced tensile stress and compressive stress due to insertion of atoms into the grain boundary. Kinetic parameters for Co indicate that stress development is dominated by nuclei coalescence and that ad-atom insertion into the grain boundary contributes to the overall stress only at very low growth rates.

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“…The I–U characteristics can be systematically divided into four stages, [30,39,40] however, the voltage regime for the same stage is different in response to the nature of the electrolyte anions. In the normal electrolysis region (up to about 250 V, 300 V, and 550 V for Na 3 PO 4 , Na 2 HPO 3, and NaH 2 PO 2 , respectively), the current increases linearly as a function of the applied voltage according to Ohm′s law in relation to the conductivity of the electrolyte [41] .…”

Section: Resultsmentioning

confidence: 99%

Tailoring Cu Electrodes for Enhanced CO₂ Electroreduction through Plasma Electrolysis in Non‐Conventional Phosphorus‐Oxoanion‐Based Electrolytes

et al. 2023

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This study presents a green and facile technique for producing micro/nano‐structured and porous Cu electrodes via in‐liquid plasma electrolysis using phosphorous‐oxoanion‐based electrolytes. The Cu electrodes exhibit unique surface structures, including octahedral nanocrystals besides nanoporous and microporous structures, depending on the employed electrolyte. The incorporation of P‐atoms into the Cu surfaces is observed. The resulting Cu electrodes have increased roughness, leading to higher current densities for CO2 electroreduction reaction. The selectivity of the modified Cu electrodes towards C2 products is highest for the Cu electrodes treated in Na2HPO3 and Na3PO4 electrolytes, while those treated in Na2H2PO2 produce the most H2. The Cu electrode treated in Na3PO4 produces ethylene (23%) at –1.1 V vs. RHE, and a comparable amount of acetaldehyde (15%) that is typically observed for Cu(110) single crystals. The enhanced selectivity is attributed to several factors, including the surface morphology, the incorporation of phosphorus into the Cu structure, and the formation of Cu(110) facets. Our results not only advance our understanding of the influence of the electrolyte’s nature on the plasma electrolysis of Cu electrodes, but also demonstrates that in‐liquid plasma treatment and phosphorous‐doping of Cu surfaces hold promise for the development of efficient Cu electrocatalysts for sustainable CO2 conversion.

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Microstructure and characterization of a novel cobalt coating prepared by cathode plasma electrolytic deposition

Cited by 32 publications

References 52 publications

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

In-Situ Stress Measurements during Cobalt Electrodeposition

Tailoring Cu Electrodes for Enhanced CO₂ Electroreduction through Plasma Electrolysis in Non‐Conventional Phosphorus‐Oxoanion‐Based Electrolytes

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Microstructure and characterization of a novel cobalt coating prepared by cathode plasma electrolytic deposition

Cited by 32 publications

References 52 publications

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO2 Nanoparticles: From Micro to Nano

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO2 Nanoparticles: From Micro to Nano

In-Situ Stress Measurements during Cobalt Electrodeposition

Tailoring Cu Electrodes for Enhanced CO2 Electroreduction through Plasma Electrolysis in Non‐Conventional Phosphorus‐Oxoanion‐Based Electrolytes

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Product

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In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

Tailoring Cu Electrodes for Enhanced CO₂ Electroreduction through Plasma Electrolysis in Non‐Conventional Phosphorus‐Oxoanion‐Based Electrolytes