Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints
Lihua Gao,
Shuangyang Zou,
Changcheng Zheng
et al.
Abstract:Nano-Ag paste is one of the most widely used die-attachment materials in modern electronic devices, which are gaining continuously increasing application in transportation industries. The nano-Ag film in a pre-formed dimension and free from the use of chemical dispersing agents has been proposed to be a promising alternative to nano-Ag paste for the die-attachment application. Although the bonding mechanisms of Nano-Ag paste have been extensively studied, little is known about the relationship between the micr… Show more
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