2012
DOI: 10.1007/s12540-012-2019-1
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Microstructural study on effects of C-alloying on Cu-Fe-P cast alloy

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Cited by 16 publications
(4 citation statements)
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“…The tendency of d to be proportional to T and t is in good agreement with previous results, [18] demonstrating that an increase in T and t facilitates an increase in the diffusion velocity and amount, respectively. Dense TiC ceramic layers have also been observed to thicken with increasing T and t, leading to increased oxidation resistance [19]…”
Section: The Effect Of Temperature and Time On The Tic Dense Ceramic mentioning
confidence: 99%
“…The tendency of d to be proportional to T and t is in good agreement with previous results, [18] demonstrating that an increase in T and t facilitates an increase in the diffusion velocity and amount, respectively. Dense TiC ceramic layers have also been observed to thicken with increasing T and t, leading to increased oxidation resistance [19]…”
Section: The Effect Of Temperature and Time On The Tic Dense Ceramic mentioning
confidence: 99%
“…To increase the strength and conductivity of the material, many researchers have conducted numerous studies on the alloying by the addition of other elements in binary Cu-Fe alloy [1][2][3][4][5][6][7][8]. Due to the extremely low solid solubility (0.0133 wt.%) of C in copper matrix [9], C is seldom added as the alloying element of copper alloys in existing research. Hyung Giun Kim [9,10] and E Jeong [11] et al studied the effect of addition of trace amounts of C (0.0133 wt.% and 0.05wt.%) on the microstructures of Cu-2.5Fe-0.1P.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the extremely low solid solubility (0.0133 wt.%) of C in copper matrix [9], C is seldom added as the alloying element of copper alloys in existing research. Hyung Giun Kim [9,10] and E Jeong [11] et al studied the effect of addition of trace amounts of C (0.0133 wt.% and 0.05wt.%) on the microstructures of Cu-2.5Fe-0.1P. They found that the addition of C increased the tensile strength and conductivity of Cu-2.5Fe-0.1P alloy by refining the Fe phase and the precipitated Fe3P particles and reducing the solid solubility of Fe atom in the copper matrix.…”
Section: Introductionmentioning
confidence: 99%
“…For commercial purpose, optimization of mechanical properties to electrical conductivity can be achieved by means of alloying elements and thermo-mechanical treatment. Many studies have been devoted to the effects of alloying elements on the Cu matrix, such as boron (B), cerium (Ce), silver (Ag), cobalt (Co), beryllium (Be), chromium (Cr), ferrous (Fe), phosphorus (P), titanium (Ti) and others [1][2][3][4][5][6][7][8][9][10]. Thereafter, the effects of these elements on the properties and structures of Cu matrix have been studied.…”
Section: Introductionmentioning
confidence: 99%