Microstructural investigation in plastically deformed and annealed copper using a microstructural model

Dey, Somdatta Ghosh; Chatterjee, P.; Gupta, S. P. Sen

doi:10.1088/0022-3727/38/9/018

Cited by 3 publications

(1 citation statement)

References 27 publications

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“…6), and the roundness Rnd is the inverse of Aspect Ratio [17]. has been noticed in another research works, the effect of cold working is not yet discernible, which is evident from the widths of the peaks [18,19]. Fig.…”

Section: Light Microscopy Images Analysismentioning

confidence: 93%

Experimental investigation of industrial copper deformed by wire drawing process

Fellah

Boumerzoug

2018

J. Fundam and Appl Sci.

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The scope of this work is to investigate the effect of the cold deformation by wire-drawing on microstructure and physical properties of industrial copper wires. Copper wires were provided by E.N.I.CA.Biskra (Algeria). We investigated some wires with different strain levels (as received, 1.20, 2.10, and ε = 3.35). X-ray diffraction, optical microscopy, and electrical resistivity measurement have been used as characterization techniques. We analyzed the photographs using "ImageJ" software and DRX patterns using PM2K software. The results revealed that the cold wire-drawing causes a lengthening of grains along the axis of wire-drawing, and introduced large amounts of defects. The results also showed, on the one hand, the decrease in crystallite size, lattice parameter, and the outer cut-off radius, on the other hand, the increase of the electrical resistivity and the dislocation density in the copper wires.

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Section: Light Microscopy Images Analysismentioning

confidence: 93%

Experimental investigation of industrial copper deformed by wire drawing process

Fellah

Boumerzoug

2018

J. Fundam and Appl Sci.

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Study of deformation stacking faults and dislocation microstructures in Cu–1Sn–Zn alloys

2005

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Deformation stacking fault probability and dislocation microstructure of cold worked Cu–Sn–5Zn alloys by x-ray diffraction line profile analysis

Dey

Chatterjee

Gupta

2006

Journal of Applied Physics

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Plastically deformed (hand-filed) Cu–Sn–5Zn ternary alloys with Sn concentrations 1, 2.5, and 5wt% are investigated. Microstructural parameters are studied in terms of x-ray diffraction profile fitting analysis. It is observed by Dey et al. [Acta. Mater. 53, 4635 (2005)] that the change in stacking fault probability (α) with Sn concentration for ternary Cu–Sn–5Zn alloys is similar to Cu-based binary alloy (Cu–Sn) system but behaves in a different manner from Cu–1Sn–Zn ternary alloy systems. The crystallite size distribution is broader for alloy with 1wt% Sn and becomes narrower with increasing Sn concentration. Value of dislocation density (ρ) is of the order of 1015m−2 and shows a compositional dependence. Type of dislocation is found to be predominantly screw; ⟨100⟩-type dipoles may also be present in the cold-worked alloys. The dislocation arrangement is found to be more correlated in case of 1wt% Sn compared to other alloys of higher Sn concentration. The stacking fault energy (γ) is obtained from modified Reed-Schramm equation and is of the order of 20mJm−2 with no significant compositional dependence.

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Microstructural investigation in plastically deformed and annealed copper using a microstructural model

Cited by 3 publications

References 27 publications

Experimental investigation of industrial copper deformed by wire drawing process

Experimental investigation of industrial copper deformed by wire drawing process

Study of deformation stacking faults and dislocation microstructures in Cu–1Sn–Zn alloys

Deformation stacking fault probability and dislocation microstructure of cold worked Cu–Sn–5Zn alloys by x-ray diffraction line profile analysis

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