Microstructural evolutions and mechanical properties of TLP-bonded WC-Co/St52 with copper interlayer

Zeidabadinejad, Hamed; Rafiei, Mahdi; Ebrahimzadeh, Iman; Omidi, Mahdi; Naeimi, Farid

doi:10.1007/s40194-023-01562-y

Weld World

2023

DOI: 10.1007/s40194-023-01562-y

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Microstructural evolutions and mechanical properties of TLP-bonded WC-Co/St52 with copper interlayer

Hamed Zeidabadinejad,

Mahdi Rafiei,

Iman Ebrahimzadeh

et al.

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2024

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Cited by 3 publications

References 25 publications

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The Effect of Bonding Time and Temperature on Microstructure and Mechanical Properties of SS316L/WC-Co Dissimilar Joint Produced by Transient Liquid Phase Bonding

Heidari-Dehkordi,

Rafiei,

Omidi

et al. 2024

J. of Materi Eng and Perform

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The Effect of Bonding Time and Temperature on Microstructure and Mechanical Properties of SS316L/WC-Co Dissimilar Joint Produced by Transient Liquid Phase Bonding

Heidari-Dehkordi,

Rafiei,

Omidi

et al. 2024

J. of Materi Eng and Perform

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Microstructural evolution during low-temperature TLP bonding of WC-6Co cemented carbide to AISI 1045 steel using multi-layer of Ni/Cu/In/Cu/Ni

Nahri,

Tavangar

2024

Weld World

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Effect of bonding temperature on microstructure and properties of TLP joined Q355 steel with Cu interlayer

Huang,

Tang,

et al. 2024

Materials Testing

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Q355 steel with Cu interlayer was bonded by transient liquid phase diffusion bonding (TLP-DB) at different bonding temperatures, and good bonding joints were obtained. The joints were characterized by optical microscopy, scanning electron microscopy and mechanical properties. The results show that there is a bending phenomenon caused by the difference of element diffusion at the bonding interface at the bonding temperature of 1050 °C. With the increase of the bonding temperature, the diffusion of Cu element plays a role in refining the grain, but with the increase of the bonding temperature, it will also lead to the overgrowth of the grain; At the bonding temperature of 1050 °C, there are obvious mutations in the diffusion of Cu and Fe elements, but the increase of the bonding temperature has a good effect on the interdiffusion of the elements. The mechanical properties test showed that with the increase of the bonding temperature, the hardness, shear strength, and impact toughness at the center of the joint increased first and then decreased, and all reached the maximum at 1100 °C. The electrochemical performance test showed that with the increase of temperature, the corrosion resistance of the joint also increased first and then decreased.

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Microstructural evolutions and mechanical properties of TLP-bonded WC-Co/St52 with copper interlayer

Cited by 3 publications

References 25 publications

The Effect of Bonding Time and Temperature on Microstructure and Mechanical Properties of SS316L/WC-Co Dissimilar Joint Produced by Transient Liquid Phase Bonding

The Effect of Bonding Time and Temperature on Microstructure and Mechanical Properties of SS316L/WC-Co Dissimilar Joint Produced by Transient Liquid Phase Bonding

Microstructural evolution during low-temperature TLP bonding of WC-6Co cemented carbide to AISI 1045 steel using multi-layer of Ni/Cu/In/Cu/Ni

Effect of bonding temperature on microstructure and properties of TLP joined Q355 steel with Cu interlayer

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