2014
DOI: 10.1007/s12540-014-4026-x
|View full text |Cite
|
Sign up to set email alerts
|

Microstructural evolution of wet deposited nickel interfacial phases on phosphorus doped silicon surface

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2015
2015
2023
2023

Publication Types

Select...
5

Relationship

1
4

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 35 publications
0
1
0
Order By: Relevance
“…Cu is oxidized more easily than Ag. When oxygen diffuses onto the surface of Cu, Cu oxide is formed and interrupts the electric flow 2122. Therefore, a certain process is required for surface treatment or the removal of the oxide layer to preserve the Cu, which comprises the main portion of the electrode.…”
Section: Introductionmentioning
confidence: 99%
“…Cu is oxidized more easily than Ag. When oxygen diffuses onto the surface of Cu, Cu oxide is formed and interrupts the electric flow 2122. Therefore, a certain process is required for surface treatment or the removal of the oxide layer to preserve the Cu, which comprises the main portion of the electrode.…”
Section: Introductionmentioning
confidence: 99%