Microstructural evolution in pulse plated nickel electrodeposits

El-Sherik, A.M.; Erb, U.; Page, John A.

doi:10.1016/s0257-8972(96)02928-3

Cited by 163 publications

(80 citation statements)

References 13 publications

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“…The nanocrystalline nature of the nickel nanoparticles produced by H 2 coevolution is not unexpected: pulsed electroplating methods, producing high plating current densities, have previously been employed to obtain nanocrystalline nickel electrodeposits. [14] We have demonstrated that nickel nano-and microparticles that are narrowly distributed in size can be deposited on an electrode surface at which H 2 is simultaneously evolved. Why is H 2 coevolution beneficial?…”

Section: Methodsmentioning

confidence: 97%

Nanocrystalline Nickel Nanoparticles

2000

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Section: Methodsmentioning

confidence: 97%

Nanocrystalline Nickel Nanoparticles

2000

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“…V, A, t and C BTA (t) have units cm 3 , cm 2 , s and mol cm )3 , respectively, in this expression. The mass transfer coefficient for BTA is estimated to be 3.71 Â 10 )3 cm s )1 using the literature value of 6.9 Â 10 )6 cm 2 s )1 for its diffusion coefficient [45] and the boundary layer thickness of 1.86Â10 )3 cm at a RDE rotating at 500 rpm.…”

Section: Incorporation Of Bta In Depositmentioning

confidence: 99%

“…Since dull and microscopically rough copper electrodeposits are normally produced by DC plating in additivefree plating baths, pulse plating [1][2][3][4][5] and various additives [6][7][8][9][10][11][12] have been used to improve their properties. Among the common additives used for copper electrodeposition in sulphate plating baths is benzotriazole (BTA) [8,[11][12][13][14][15][16][17][18][19][20][21][22][23][24], which is also an effective corrosion inhibitor for copper and its alloys by forming a protective chemisorbed film [25][26][27][28][29][30][31][32][33][34].…”

Section: Introductionmentioning

confidence: 99%

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Tantavichet

Pritzker

2005

J Appl Electrochem

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DC and pulse plating of copper in acidic sulphate solutions containing benzotriazole (BTA) has been studied. When BTA is the only additive present, it generally has a stronger effect than the plating mode and significantly enhances deposit morphology and surface brightness over that produced in additive-free solutions. XPS and voltammetry analyses indicate that BTA is present at the surface of the deposit, but not through the entire coating, and does not become depleted within the solution over the course of plating. This may help explain why the initial surface smoothness and brightness is maintained as the coating grows beyond 5 lm thick. Plating mode does have a strong effect on deposit morphology under specific conditions. Pulse current plating at low frequency (50 Hz) and low duty cycle (20%) produces deposits with poorer quality than that obtained by DC plating. Pulse reverse plating yields very coarse and dull coatings when the frequency is low enough for metal dissolution to occur during the reverse time. Regardless of the plating mode, the addition of Cl ) eliminates most of the beneficial effects of BTA and leads to very rough and dull deposits. The observed effects are discussed in light of previous research on the electrodeposition and corrosion of the Cu-BTA and Cu-BTA-Cl systems.

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“…Conventionally, Ni coatings have been prepared using dc electrochemical methods [4][5][6][7] . More recently, use of pulse electrodeposition has become popular since it results in Ni coatings with refined grain structure 8,9 and attractive corrosion [10][11][12] and tribological properties [13][14][15][16][17][18] . Pulse plating is undertaken when current is applied in repetitive (pulse on -pulse off) square wave fashion rather than continuously as in dc plating.…”

Section: Introductionmentioning

confidence: 99%

Corrosion Behavior of Coarse- and Fine-Grain Ni Coatings Incorporating NaH2PO4.H2O Inhibitor Treated Substrates

et al. 2015

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Plain carbon steel substrates were treated with NaH2PO4.H2O inhibitor for 24 hours and coated with Ni using dc and pulse electrodeposition in standard Watt's bath. The effect of dc and pulse electrodeposition, on the microstructure and corrosion properties of Ni coatings in 3.5 wt% NaCl solution was studied. The effect of inhibitor on the deposition process and corrosion behavior was also examined. Materials characterization was performed using field emission scanning electron microscopy, cross-sectional scanning transmission electron microscopy, atomic force microscopy, x-ray diffraction and nanoindentation. Experimental results indicated that pulse electrodeposition produced fine grained Ni coatings that showed lower corrosion rate compared to coarse grained dc electrodeposited Ni. Pretreatment of substrates with inhibitor did not adversely affect the deposition process and adherent Ni coatings were readily developed. The results showed that pulse electrodeposition could be used to produce hard corrosion resistant Ni coatings while the inhibitor treatment yielded enhanced corrosion protection by providing a protective buffer layer between the Ni coating and the substrate.

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Microstructural evolution in pulse plated nickel electrodeposits

Cited by 163 publications

References 13 publications

Nanocrystalline Nickel Nanoparticles

Nanocrystalline Nickel Nanoparticles

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Corrosion Behavior of Coarse- and Fine-Grain Ni Coatings Incorporating NaH2PO4.H2O Inhibitor Treated Substrates

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