Microstructural evolution in passivated Al films on Si substrates during thermal cycling

Legros, Marc; Hemker, Kevin J.; Gouldstone, Andrew; Suresh, S.; Keller-Flaig, R.-M.; Arzt, Eduard

doi:10.1016/s1359-6454(02)00157-x

Cited by 56 publications

(38 citation statements)

References 36 publications

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“…[28] However, for the films studied here, the minimization of these energies is not expected to play a significant role in either the initial grain growth or the eventual stagnation since the films were very strongly <111>-fiber textured even in the as-deposited condition and annealing resulted in minimal strengthening of this texture, as seen in the fiber plot of Fig 10. In addition, the Al films are in the zero stress, or lowcompressive steady-state stress state at the annealing temperature and reach this state during heating to temperature. [29][30][31] Thus, film stress and its relaxation are also not expected to play a significant role in the observed grain growth followed by stagnation.…”

Section: Resultsmentioning

confidence: 99%

Grain Boundary Properties and Grain Growth: Al Foils, Al Films

et al. 2004

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Relative grain boundary energy as a function of misorientation angle has been measured in cube-oriented, i.e., <100> fiber-textured, 120 µm-thick Al foil using orientation imaging microscopy and a statistical multiscale method. The energies of low-angle boundaries increase with misorientation angle, in good agreement with the Read-Shockley model. The relative energies of high-angle boundaries exhibit little variation with misorientation. Examination of the grain structure of <111> fiber-textured, 100 nm-thick Al films annealed at 400 °C for 0.5-10 h shows 5 and 6 sided grains to be the most frequent, and the fraction of four-sided grains to be significant. The mean number of sides is slightly lower than the expected value of 6 for twodimensional structures. Of lognormal, gamma and Rayleigh distributions, gamma gives the best fit to the grain size data in the films; however, the difference between gamma and lognormal is small. Grain growth is not self-similar and stagnates after one hour of annealing. The evolution of the grain size distribution with time indicates that the growth stagnation in the films is neither consistent with boundary pinning by grooving nor with conventional treatments of solute drag. Surface, elastic-strain and plastic-strain energy driving forces do not play a significant role in the grain growth and the subsequent stagnation since the films are strongly textured even in the asdeposited state. The steady-state distributions of reduced grain area for two-dimensional, Monte Carlo and partial differential equation based simulations show excellent agreement with each other, even when anisotropic boundary energies are used. However, comparison with experimental distributions reveals a significantly higher population of small grains in the experiments.

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Section: Resultsmentioning

confidence: 99%

Grain Boundary Properties and Grain Growth: Al Foils, Al Films

et al. 2004

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“…Possibilities for intrinsic stress development due to recovery include grain growth [29][30][31][32]411, dislocation annihilation [41], or possibly twin boundary motion (twins were discovered in the as-released Au film). Currently, transmission electron microscopy (TEM) studies are being performed to ascertain the active deformation mechanism during recovery.…”

Section: Discussionmentioning

confidence: 99%

“…Currently, transmission electron microscopy (TEM) studies are being performed to ascertain the active deformation mechanism during recovery. Recent TEM studies [41] have show that during thermal exposure, dislocation annihilation rate decreases and diffusional processes become dominant. This observation is consistent with our concept of the recovery being exhaustible for a given exposure to temperature and time.…”

Section: Discussionmentioning

confidence: 99%

“…Stresses generated during film growth are typically referred to as "intrinsic stresses" [28]. determined to play an increasingly important role as dislocation processes were exhausted during thermal exposure [41]. In summary, prior studies have shown that the active deformation mechanism in metallic thin films primarily depends on stress, temperature, time, grain size, film thickness, material, and passivation.…”

Section: Introductionmentioning

confidence: 99%

“…Figure 5.1 was generated using a value of f = 1.57 J / m 2 ( [15] for details of the calculation), density functional theory (DFT) calculation [41,42], and experiment [43].…”

Section: Introductionmentioning

confidence: 99%

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Multiscale Modeling of Deformation in Polycrystalline Thin Metal Films on Substrates

2005

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The time‐dependent irreversible deformation of a thin metal film constrained by a substrate is investigated by a mesoscopic discrete dislocation simulation scheme incorporating information from atomistic studies of dislocation nucleation mechanisms. The simulations take into account dislocation climb along the grain boundaries in the film as well as dislocation glide along slip planes inclined and parallel to the film/substrate interface. The calculated flow stress and other features are compared with relevant experimental observations. The work is focused on deformation of a polycrystalline film without a cap layer, for which diffusive processes play an important role. The dislocation‐based simulations reveal information on the prevailing deformation mechanisms under different conditions and for different film thicknesses. Despite of the limitations of the two‐dimensional dislocation model, the simulations exhibit a film thickness dependent transition between creep dominated and dislocation glide dominated deformation, which is in good agreement with experimental observations.

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Microstructural evolution in passivated Al films on Si substrates during thermal cycling

Cited by 56 publications

References 36 publications

Grain Boundary Properties and Grain Growth: Al Foils, Al Films

Grain Boundary Properties and Grain Growth: Al Foils, Al Films

Atomistic modeling of nanowires, small-scale fatigue damage in cast magnesium, and materials for MEMS

Multiscale Modeling of Deformation in Polycrystalline Thin Metal Films on Substrates

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