Microstructural evolution and mechanical behavior of copper processed by low strain amplitude multi-directional forging

Flausino, Paula Cibely Alves; Nassif, Maria Elisa Landim; Bubani, Franco de Castro; Pereira, Pedro Henrique R.; Aguilar, Maria Teresa Paulino; Cetlin, Paulo Roberto

doi:10.1016/j.msea.2019.04.075

Cited by 15 publications

(21 citation statements)

References 56 publications

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“…Figure a,b shows that a significant material work hardening occurs at the initial MDF stages for Δ ε = 0.15 and 0.30, resulting in flow stresses >4× above the yield strength ( σ y ) of the annealed material. The overall shape of the cumulative SS curves in Figure c is very similar for all strain amplitudes and typical of deformation conditions dominated by dynamic recovery . Work hardening is followed by an almost stationary flow stress achieved at ε ≈ 2.0, 2.1, and 2.4 for Δ ε = 0.075, 0.15, and 0.30, respectively.…”

Section: Resultsmentioning

confidence: 67%

“…The overall shape of the cumulative SS curves in Figure c is very similar for all strain amplitudes and typical of deformation conditions dominated by dynamic recovery . Work hardening is followed by an almost stationary flow stress achieved at ε ≈ 2.0, 2.1, and 2.4 for Δ ε = 0.075, 0.15, and 0.30, respectively. It should be noted that the saturation stress increases as the strain amplitude is raised, reaching ≈360 MPa for MDF 0.075 , ≈380 MPa for MDF 0.15 , and ≈390 MPa for MDF 0.30 .…”

Section: Resultsmentioning

confidence: 67%

“…The latter likely correspond to highly strained regions that underwent profuse micro shear banding during deformation . It should be further noted that the area fraction of these dark regions increases with increasing ε and Δ ε ; for MDF 0.075 , this fraction is ≈53% after ε = 10.8, for MDF 0.15 it evolves from ≈30% ( ε = 0.9) to 58% ( ε = 10.8), and for MDF 0.30 the evolution is from ≈39% to 70% considering the same accumulated strains.…”

Section: Resultsmentioning

confidence: 89%

“…It is evident in Figure a,b the occurrence of a rapid stress rise at the end of each compression due to the confining action of the die walls. These stress increments were not considered while constructing the cumulative flow stress curves as they cannot be attributed solely to the mechanical behavior of the material . For comparison purposes, the cumulative SS curves obtained in this study are plotted in Figure c together with the cumulative SS curve obtained for the same metal after 48 MDF cycles using Δ ε = 0.075 …”

Section: Resultsmentioning

confidence: 99%

“…Plots of a) grain size ( D ) and b) fraction of submicrometric grains ( f D≤1 ) as a function of ε and Δ ε for copper after MDF 0.075 , MDF 0.15 , and MDF 0.30 .…”

Section: Resultsmentioning

confidence: 99%

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Influence of Strain Amplitude on the Microstructural Evolution and Flow Properties of Copper Processed by Multidirectional Forging

et al. 2020

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The search for the development of metals with high mechanical strength has raised intense interest in severe plastic deformation (SPD) methods. [1,2] These involve the application of intense straining to ultimately produce ultrafine-grained (UFG) materials. Among the available SPD techniques, multidirectional forging (MDF) [3-5] is one of the simplest procedures and can be readily applied in industry. During MDF processing, a cuboid workpiece is successively submitted to the same compression strain along its three orthogonal axes, so that after each three compressions (a so-called MDF cycle) the dimensions of the sample return to the unprocessed state. [4,6] MDF processing allows the determination of the material in situ stressstrain curves for every compression step and can be performed with or without the use of dies confining the plastic flow. [3,7] Although the grain refinement mechanisms associated with SPD are still not fully understood, it is generally accepted that it is caused by the fragmentation of the original grains in the material by boundaries formed from dislocation arrangements created during straining. [8] Sakai et al. [3] have emphasized the importance of the development of micro shear bands (MSBs), which are localized planar sheared regions within the initial grains, in the development of UFG structures in metals processed by different SPD procedures [3,7,9-18] This microstructural evolution is also referred to in the literature as continuous dynamic recrystallization [3,7,9,12,19] and the successive deformation at mutually orthogonal

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Section: Resultsmentioning

confidence: 67%

Section: Resultsmentioning

confidence: 67%

Section: Resultsmentioning

confidence: 89%

Section: Resultsmentioning

confidence: 99%

“…Plots of a) grain size ( D ) and b) fraction of submicrometric grains ( f D≤1 ) as a function of ε and Δ ε for copper after MDF 0.075 , MDF 0.15 , and MDF 0.30 .…”

Section: Resultsmentioning

confidence: 99%

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Influence of Strain Amplitude on the Microstructural Evolution and Flow Properties of Copper Processed by Multidirectional Forging

et al. 2020

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Faceting of Twin Grain Boundaries in High‐Purity Copper Subjected to High Pressure Torsion

et al. 2019

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The microstructure of high‐purity 5N5 copper processed by high pressure torsion (HPT) is studied. Close to the top and bottom surfaces of HPT disk, the 2–10 μm‐thick ultrafine‐grained layers with equiaxial grains and grain size of about 150 nm are formed. This grain size is typical for HPT of copper and its alloys. However, the remaining bulk layer in the HPT disk contained mainly elongated intersecting twins with high aspect ratio and length of up to 1 μm. These twin grain boundaries (GBs) are faceted. The geometry of the GB facets is analyzed using Σ3 coincidence site lattice (CSL). The Σ3 twins after HPT contained (100)CSL, (110)CSL, (010)CSL, and non‐CSL 9R facets, but not (120)CSL and (130)CSL facets. Earlier, the stability diagram for the Σ3 GB facets is experimentally constructed for the same 5N5 high‐purity copper. The comparison of the data with this diagram allows to estimate for the first time the effective temperature of pure copper during HPT processing at room temperature (RT): Teff = 920 ± 50 K. In other words, the HPT at RT results in Σ3 GB facets as if the sample is annealed at Teff = 920 ± 50 K.

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Microstructural and Mechanical Evaluation of Pure Copper Rods Processed by Severe Plastic Deformation Method of Hydrostatic Cyclic Extrusion Compression

Siahsarani

Faraji

Damirchi

et al. 2022

J. of Materi Eng and Perform

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Microstructural evolution and mechanical behavior of copper processed by low strain amplitude multi-directional forging

Cited by 15 publications

References 56 publications

Influence of Strain Amplitude on the Microstructural Evolution and Flow Properties of Copper Processed by Multidirectional Forging

Influence of Strain Amplitude on the Microstructural Evolution and Flow Properties of Copper Processed by Multidirectional Forging

Faceting of Twin Grain Boundaries in High‐Purity Copper Subjected to High Pressure Torsion

Microstructural and Mechanical Evaluation of Pure Copper Rods Processed by Severe Plastic Deformation Method of Hydrostatic Cyclic Extrusion Compression

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