Microstructural and mechanical characteristics of Cu–Cu2O composites compacted with pulsed electric current sintering and hot isostatic pressing

Ritasalo, Riina; Cura, M. Erkin; Liu, X.W.; Ge, Yanling; Kosonen, Topi; Kanerva, Ulla; Söderberg, Outi; Hannula, Simo Pekka

doi:10.1016/j.compositesa.2012.09.003

Cited by 22 publications

(6 citation statements)

References 55 publications

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“…In calculating the relative density of specimens, theoretical density of copper and YSZ materials was taken as 8.96 [16] and 6.05 g/cm 3 [38], respectively. The relative density values show that the sintering by SPS system has led to the considerable consolidation of specimens, as mentioned by others [4,16,36]. In this study, the maximum densification has obtained for pure copper due to its formability.…”

Section: Resultsmentioning

confidence: 99%

“…Nowadays, it is well known that by proper reinforcement selection, better properties for MMCs could be provided. Considering this comment, a variety of particulate ceramic materials like Al 2 O 3 [4,6,[13][14][15], SiC [12], Cu 2 O [16], and TiB 2 [8] have been utilized to reinforce the copper matrix. The usage of above reinforcements has led to the enhancement of mechanical properties, which have been reported by researchers cited above.…”

Section: Introductionmentioning

confidence: 99%

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Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

Mirazimi

Abachi

Purazrang

2016

Acta Metall. Sin. (Engl. Lett.)

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Copper matrix composites have received more attentions as possible candidate for thermal and electrical conductive materials to be used in electrical contact applications. In this study, five-layered Cu/YSZ (yttria-stabilized zirconia) functionally graded material (FGM) and copper matrix composite specimens containing 3 and 5 vol% YSZ particles plus pure Cu specimen were synthesized using powder metallurgy (PM) route and spark plasma sintering (SPS) consolidation process. The microstructural and some physical, mechanical features of all specimens were characterized. Microscopic examinations showed that ultrafine YSZ particles were distributed in the copper matrix almost homogeneously. An appropriate interface was observed at each layer of FGM. The density measurement indicated that the graded structure of the composite could be well densified after the SPS process. The microhardness values of various layers of Cu/ YSZ FGM specimen were gradually altered from 56.3 (pure copper side) to 75.2 HV (Cu-5 vol% YSZ side). The increase of YSZ content resulted in a decrease in electrical conductivity. Additionally, thermal conductivity of Cu/YSZ FGM specimen [308.0 W/(m K)] was determined to be higher than that of the Cu-5 vol% YSZ composite specimen [260.7 W/ (m K)]. Accordingly, it can be concluded that the Cu/YSZ FGM can be a good candidate for the electrical applications, like sliding electrical contacts, where different material characteristics in the same component are required.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

Mirazimi

Abachi

Purazrang

2016

Acta Metall. Sin. (Engl. Lett.)

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“…18 vs 49 or 73 nm, respectively; see Table S4). This is mainly due to the potential sintering of Cu 0 nanoparticles and clusters into larger particles under the reaction conditions (visible irradiation, continuous exposure to formic acid vapor), which is not the case of the oxides such as Cu 2 O . A similar phenomenon has been previously documented during methanol photo-oxidation over highly dispersed silver (Ag) embedded into ZX-Bi zeolite where the migration and aggregation of sub-nanosized Ag n δ+ clusters resulted in the formation of larger Ag nanoparticles with the evolution of reaction time .…”

Section: Resultsmentioning

confidence: 58%

“…45 Furthermore, the DR-UV−vis spectra show a single surface plasmon resonance (SPR) peak at 566 nm, which indicates the formation of metallic copper sites (Figure 2b). 46 Additional TEM analysis was performed on Cu 2 O/Fe 3 O 4 composites after the reaction to gain insight into the environment of copper (Figures S6 and 2c). The EDX-STEM elemental mapping of the Cu 2 O/Fe 3 O 4 sample after reaction (Figure S6) reveals the presence of Cu regions (in red in overlaid color map) along with Cu 2 O (in pink in the overlaid color map as a mixture of Cu-red and O-blue).…”

Section: Photocatalytic Activity Ofmentioning

confidence: 99%

Earth-Abundant-Based Photocatalysts for Efficient and Selective H₂ Production through Reforming of Formic Acid under Visible Light

Hamoud,

Wolski,

Abdelli

et al. 2023

ACS Catal.

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“…The results showed that hardness increased with increasing laser power and irradiation time. The lowest hardness value of 30.10 N mm −2 was observed for the Cu NP pattern sintered in laser irradiation with 400 mJ for 15 s, while the highest hardness was found in the pattern sintered with 800 mJ for 30 s. The presence of oxygen in Cu contributes to this strengthening effect, as oxygen precipitates within the Cu and acts as a barrier against the movement of Cu NPs during grain growth [58,59]. An increase in oxygen dispersion within the Cu would correlate with an increased hardness.…”

Section: Mechanical Properties Of Cu Np Patternsmentioning

confidence: 99%

Effect of dual sintering with laser irradiation and thermal treatment on printed copper nanoparticle patterns

Chowdhury,

Young,

Poche

et al. 2023

Nanotechnology

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The dual sintering of copper (Cu) nanoparticles (NPs) was introduced to produce conductive patterns suitable for flexible electronics applications. In this method, laser irradiation using a Nd:YAG laser with a wavelength of 1064 nm was performed at laser powers of 400, 600, and 800 mJ. The laser irradiation time was 15 and 30 s for each laser power. After laser irradiation, all of the Cu NP patterns were thermally sintered under formic acid (FA) vapors. The temperature and time for thermal sintering were selected as 260 °C and 15 min, respectively. The resultant physical, chemical, electrical and mechanical properties were evaluated and compared considering the six different dual sintering conditions. The Cu NP patterns sintered using 800 mJ for 30 s showed increased necking and coalescence compared to the other patterns and featured a microstructure with increased density. Despite being oxidized, the Cu NP patterns sintered with 800 mJ for 30 s showed the lowest electrical resistivity of 11.25 μΩ·cm. The surface of every sintered Cu pattern was oxidized, and mechanical hardness increased with increasing laser power. The Cu NP pattern sintered with 800 mJ for 30 s demonstrated the highest hardness of 48.64 N/mm2. After sintering using the six different conditions, the Cu NP patterns exhibited a weight loss of 0.02-3.87 wt%, and their roughness varied in the range of 26.15-74.08 nm. This can be attributed to the effective removal of organic residues and the degree of particle agglomeration. After performing folding tests up to 50 cycles, Cu NP patterns showed an upward trend in resistance with increasing laser power and time. The highest and lowest resistance ratios were observed as 3.97 and 17.24 for the patterns sintered at 400 mJ for 15 s and 800 mJ for 30 s, respectively.

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Microstructural and mechanical characteristics of Cu–Cu2O composites compacted with pulsed electric current sintering and hot isostatic pressing

Cited by 22 publications

References 55 publications

Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

Earth-Abundant-Based Photocatalysts for Efficient and Selective H₂ Production through Reforming of Formic Acid under Visible Light

Effect of dual sintering with laser irradiation and thermal treatment on printed copper nanoparticle patterns

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Microstructural and mechanical characteristics of Cu–Cu2O composites compacted with pulsed electric current sintering and hot isostatic pressing

Cited by 22 publications

References 55 publications

Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

Earth-Abundant-Based Photocatalysts for Efficient and Selective H2 Production through Reforming of Formic Acid under Visible Light

Effect of dual sintering with laser irradiation and thermal treatment on printed copper nanoparticle patterns

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Product

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Earth-Abundant-Based Photocatalysts for Efficient and Selective H₂ Production through Reforming of Formic Acid under Visible Light