Abstract:We demonstrate that picosecond ultrasonics provides detailed information on the structure and properties of patterned arrays of copper fine lines used in silicon chip interconnections. In this method, the sample surface is momentarily heated several o C using a pump laser beam, and the transient change in the optical reflectivity is measured by a probe laser beam. Measurements of the optical reflectivity are made on time scales ranging from picoseconds to nanoseconds, revealing information on electronic, acous… Show more
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