Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications

Pohlmann, W.; Jacob, Arne F.; Schaefer, H.; Hennemann, O.‐D.

doi:10.1109/adhes.1998.742010

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. 1998

DOI: 10.1109/adhes.1998.742010

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Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications

W. Pohlmann¹,

Arne F. Jacob²,

H. Schaefer³

et al.

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Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications

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References 10 publications

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