2015
DOI: 10.1299/transjsme.15-00214
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Microscopic observation of creep-fatigue crack propagation in lead-free solder

Abstract: Creep-fatigue crack propagation tests of lead-free solder were conducted under various loading waveforms. The waveforms adapted in displacement-controlled tests were four triangular waveforms: pp waveform having fast loading-unloading, cc waveform having slow loading-unloading, cp waveform with slow loading followed by fast unloading, and pc waveform with fast loading followed by slow unloading, and three waveforms with hold time: cc-h waveform having a hold time under tension and compression,cp-h waveform hav… Show more

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