Microscale mechanical properties dependent on the strain rate and temperature of cured isotropic conductive adhesive

Xiao, Gesheng; Li, Zhigang; Liu, Erqiang; Qiao, Li; Shu, Xuefeng; Sun, Ruijing

doi:10.1007/s11043-019-09438-9

Cited by 2 publications

(2 citation statements)

References 28 publications

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“…In nanoindentation tests, the response of the material is affected by the loading strain rate. Xiao et al [ 67 ] showed that the slopes of contact stiffness–depth curve, modulus, and hardness of cured isotropic conductive adhesive increase with the increasing loading strain rate. Mao et al [ 68 ] showed that the hardness and creep flow of the tripler plane of potassium dihydrogen phosphate crystal increase with the loading strain rate.…”

Section: Resultsmentioning

confidence: 99%

Inverse Identification of Single-Crystal Plasticity Parameters of HCP Zinc from Nanoindentation Curves and Residual Topographies

et al. 2022

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This paper investigates the orientation-dependent characteristics of pure zinc under localized loading using nanoindentation experiments and crystal plasticity finite element (CPFEM) simulations. Nanoindentation experiments on different grain orientations exhibited distinct load–depth responses. Atomic force microscopy revealed two-fold unsymmetrical material pile-up patterns. Obtaining crystal plasticity model parameters usually requires time-consuming micromechanical tests. Inverse analysis using experimental and simulated loading–unloading nanoindentation curves of individual grains is commonly used, however the solution to the inverse identification problem is not necessarily unique. In this study, an approach is presented allowing the identification of CPFEM constitutive parameters from nanoindentation curves and residual topographies. The proposed approach combines the response surface methodology together with a genetic algorithm to determine an optimal set of parameters. The CPFEM simulations corroborate with measured nanoindentation curves and residual profiles and reveal the evolution of deformation activity underneath the indenter.

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Section: Resultsmentioning

confidence: 99%

Inverse Identification of Single-Crystal Plasticity Parameters of HCP Zinc from Nanoindentation Curves and Residual Topographies

et al. 2022

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“…Conductive adhesive is currently used. However, the conductive adhesive is expensive and also subject to aging, so a material with the same performance as the conductive adhesive is needed instead of the conductive adhesive [32]. Therefore, a low-melting-point solder, indium-tin alloy, is chosen as the connection material for the cells.…”

Section: Introductionmentioning

confidence: 99%

Preparation of In/Sn Nanoparticles (In3Sn and InSn4) by Wet Chemical One-Step Reduction and Performance Study

et al. 2022

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The preparation of binary alloys by surfactant-assisted chemical reduction in aqueous solution at room temperature has become a hot topic. In this article low melting point tin/indium (Sn/In) nanoparticles are synthesized. The formation process of the alloy was studied. Scanning electron microscopy, energy spectrometry, and X-ray diffraction are used to determine the morphology, composition, and crystal structure of the nanoparticles. Study found that fully alloyed indium-tin nanoparticles can be obtained by wet chemical method and the main phases of indium-tin alloy are β-phase (In3Sn) and γ-phase (InSn4). However, the Sn phase appears at a low content of indium (40 wt%). When the content of indium increases to 45 (wt%), the tin phase disappears. In addition, the most important finding is that the composition of the indium-tin alloy can be changed by ratio control, and the content of In3Sn increases with the increase of indium content. The relative content of In3Sn attains a maximum when the content of indium increases to 60 (wt%). In contrast, the content of InSn4 decreases. Finally, differential scanning calorimetry measurements is performed to understand the melting behavior of the nanoparticles and low melting temperatures are achieved for a wide range of indium compositions (from 40% to 60%). The melting temperature is found to be in the range of 125–132 °C and it increased with increasing In3Sn (also the increase of indium content). This gives us a new understanding into the binary alloy nano-system and gives important information for the application of low temperature alloy solders. The choice of composition can be based on the corresponding melting point.

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Microscale mechanical properties dependent on the strain rate and temperature of cured isotropic conductive adhesive

Cited by 2 publications

References 28 publications

Inverse Identification of Single-Crystal Plasticity Parameters of HCP Zinc from Nanoindentation Curves and Residual Topographies

Inverse Identification of Single-Crystal Plasticity Parameters of HCP Zinc from Nanoindentation Curves and Residual Topographies

Preparation of In/Sn Nanoparticles (In3Sn and InSn4) by Wet Chemical One-Step Reduction and Performance Study

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