Abstract:The escalating heat dissipation problem in electronic devices has become the key driver to numerous investigations on new cooling techniques, including the heavily-researched microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geometries, which is believed largely due to the fabrication and operational challenges. In present study, experiments were conducted to attain high heat removal capabilities comparable to that of microchannels in a circ… Show more
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