Micropillar compression of Al/SiC nanolaminates

Singh, Davinder; Chawla, Nikhilesh; Tang, G.; Shen, Yansong

doi:10.1016/j.actamat.2010.08.025

Cited by 88 publications

(48 citation statements)

References 32 publications

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“…The effect of the taper has already been studied in Ref. [32] from the experimental and simulation perspective. It was concluded that taper can induce some apparent strain hardening.…”

Section: Micropillar Compression Testsmentioning

confidence: 99%

“…For very small diameters in monolithic materials approaching the 50-60 nm damage depth, ion beam-induced surface damage might have an influence on the micropillar compression behavior [27]. In nanolaminates, the micropillar diameter does not influence the flow stress significantly [32], since the characteristic length scale that controls the mechanical response, the layer thickness, is much smaller than the micropillar diameter. For the reasons described above, it is assumed that the ion beam-induced surface damage should play a minor role on the deformation behavior of micropillars made of nanoscale multilayers.…”

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

“…The sample holder was continuously rotated during sputtering to obtain uniform layer thicknesses. The deposition rates were ^7.5 nm min -1 for A1 and 3.9 nm min -1 for SiC [2,19,31,32], A total of 40 layers (20 A1 and 20 SiC) were deposited. The individual layer thickness of A1 and SiC were targeted to be ~60 nm.…”

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

“…In all cases, with and without taper, A 0 was taken as the top cross-sectional area of the pillar. The stresses and strains, including the Sneddon [35] correction for the sink-in effect at the base of the pillar, were calculated using the methods outlined in previous works [26,32,36]. The (compressive) true stress and strain are given by…”

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

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High temperature micropillar compression of Al/SiC nanolaminates

et al. 2013

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The effect of the temperature on the compressive stress-strain behavior of Al/SiC nanoscale multilayers was studied by means of micropillar compression tests at 23 °C and 100 °C. The multilayers (composed of alternating layers of 60 nm in thickness of nanocrystalline A1 and amorphous SiC) showed a very large hardening rate at 23 °C, which led to a flow stress of 3.1 ± 0.2 GPa at 8% strain. However, the flow stress (and the hardening rate) was reduced by 50% at 100 °C. Plastic deformation of the A1 layers was the dominant deformation mechanism at both temperatures, but the A1 layers were extruded out of the micropillar at 100 °C, while A1 plastic flow was constrained by the SiC elastic layers at 23 °C. Finite element simulations of the micropillar compression test indicated the role played by different factors (flow stress of Al, interface strength and friction coefficient) on the mechanical behavior and were able to rationalize the differences in the stress-strain curves between 23 °C and 100 °C.

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“…The effect of the taper has already been studied in Ref. [32] from the experimental and simulation perspective. It was concluded that taper can induce some apparent strain hardening.…”

Section: Micropillar Compression Testsmentioning

confidence: 99%

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

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High temperature micropillar compression of Al/SiC nanolaminates

et al. 2013

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“…These extremely high work-hardening rates approach the theoretical maximum for thin films [14]. This type of behaviour is also seen in Al-SiC nanolaminates [15]. In addition, nanolaminates can be tolerant to radiation damage since the interfaces act as sinks for defects that normally accumulate in coarse-grain materials [16].…”

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confidence: 75%

Indentation Fracture Response of Al–TiN Nanolaminates

Mook

Raghavan

Baldwin

et al. 2013

Materials Research Letters

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Supplementary Material Available OnlineIndentation fracture experiments on aluminium-titanium nitride nanolaminates were conducted both inside and outside of a scanning electron microscope (SEM). Remarkably, indentation fracture toughness increases with increasing strength for bilayer thicknesses less than 10 nm. In addition, slower strain rates favour formation of lateral cracking while increasing rates favour formation of radial cracks. SEM movies show that an increase in radial crack length does not occur during the unloading cycle; this is due to flow of aluminium into the cracks during unloading and is a form of self-healing which should be applicable to metal-ceramic nanolaminates in general.

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High‐Temperature Micropillar Compression Creep Testing of Constituent Phases in Lead‐Free Solder

et al. 2015

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As the size of solder interconnects used in electronics packaging decreases, methods for characterizing the creep behavior of solder at ever smaller length scales need to be developed. Long duration micropillar compression experiments at constant loads and temperatures ranging from 60 to 160°C were used to characterize the creep behavior in pure Sn dendrites and the Sn-Ag 3 Sn eutectic constituent in a leadfree Sn-3.5Ag solder alloy. The stress exponent for the Sn dendtrites as well as the eutectic at low stresses was shown to be 1, suggesting a diffusion-based mechanism, while at high stresses the eutectic stress exponent was 4, suggesting a dislocation-based mechanism. Low activation energies indicative of a high diffusivity path (around 30 kJ mol À1 ) were seen in the dendrites at all temperatures and stresses as well as in the eutectic at low stresses. In the high stress regime of the eutectic, the activation energy transitions from 36 to 97 kJ mol À1 above 120°C, indicating a transition to a lattice diffusionbased mechanism. 1168 wileyonlinelibrary.com

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Micropillar compression of Al/SiC nanolaminates

Cited by 88 publications

References 32 publications

High temperature micropillar compression of Al/SiC nanolaminates

High temperature micropillar compression of Al/SiC nanolaminates

Indentation Fracture Response of Al–TiN Nanolaminates

High‐Temperature Micropillar Compression Creep Testing of Constituent Phases in Lead‐Free Solder

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