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2001
DOI: 10.1016/s0924-4247(00)00563-x
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Micromechanical devices with embedded electro-thermal-compliant actuation

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Cited by 116 publications
(55 citation statements)
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“…The most recent development was by Eder et al 18 , where they placed an STM tip on either side of a freestanding graphene film and demonstrated tunable membrane deformations using electrostatic control . As far as thermally induced mechanical movement in real devices is concerned, thermal actuation of a microelectromechanical device (that is, silicon-on-insulator technology) was first introduced because thermal loads provide a significantly larger force as compared with electrostatic actuation 19 . Heating under the STM tip has been studied experimentally and a giant enhancement in electronic tunnelling at higher energies due to an intrinsic phonon-mediated inelastic channel was found to be responsible for an unexpected gap-like feature in the graphene tunnelling spectrum 20 .…”
mentioning
confidence: 99%
“…The most recent development was by Eder et al 18 , where they placed an STM tip on either side of a freestanding graphene film and demonstrated tunable membrane deformations using electrostatic control . As far as thermally induced mechanical movement in real devices is concerned, thermal actuation of a microelectromechanical device (that is, silicon-on-insulator technology) was first introduced because thermal loads provide a significantly larger force as compared with electrostatic actuation 19 . Heating under the STM tip has been studied experimentally and a giant enhancement in electronic tunnelling at higher energies due to an intrinsic phonon-mediated inelastic channel was found to be responsible for an unexpected gap-like feature in the graphene tunnelling spectrum 20 .…”
mentioning
confidence: 99%
“…L is length of the driving beam and k is the thermal conductivity coefficient. For Biot numbers of much less than unity, it is reasonable to assume a uniform temperature distribution across the solid at any time, representing a small temperature gradient in it (Moulton and Ananthasuresh 2001). Therefore, the TEMA is decomposed into three line shape micro-beams; two thin driving beams and one thick beam attached to a flexure.…”
Section: Thermal Analysismentioning
confidence: 99%
“…Many of the micro-machined electromechanical parts (MEMS) have heating elements (e.g., AFM cantilever with heated tip, heatuaters) [68,69]. Thermometry (temperature measurement) of these parts is critical to ensuring their functionality.…”
Section: Thermometry Of Micro-machined Componentsmentioning
confidence: 99%