2011 IEEE International Ultrasonics Symposium 2011
DOI: 10.1109/ultsym.2011.0436
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Micromachining techniques in developing high frequency piezoelectric composite ultrasound array transducers

Abstract: The Series of micromachining techniques have systematically been developed in this paper for fabrication of high frequency piezoelectric composite ultrasonic array transducers. According to the specific requirements in different stages of production of array transducers, different micromachining techniques are employed in fabricating piezoelectric active material, attaching backing material to the transducer, and making an electric interconnection board for array elements electric connection. To prove the feas… Show more

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Cited by 4 publications
(3 citation statements)
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“…Composite piezoelectric substrates are generally favoured as the active material for ultrasound imaging transducers owing to their higher electromechanical coupling and lower acoustic impedance than bulk material [10] [11]. For the 15 MHz array, the 1-3 composite development used the "dice and fill" method for creating the piezoelectric pillars.…”
Section: B Dicing Process Developmentmentioning
confidence: 99%
“…Composite piezoelectric substrates are generally favoured as the active material for ultrasound imaging transducers owing to their higher electromechanical coupling and lower acoustic impedance than bulk material [10] [11]. For the 15 MHz array, the 1-3 composite development used the "dice and fill" method for creating the piezoelectric pillars.…”
Section: B Dicing Process Developmentmentioning
confidence: 99%
“…Composite piezoelectric substrates are generally favoured as the active material for ultrasound imaging transducers owing to their higher electromechanical coupling and lower acoustic impedance than bulk material [10] [11]. For the 15 MHz array, the 1-3 composite development used the "dice and fill" method for creating the piezoelectric pillars.…”
Section: B Dicing Process Developmentmentioning
confidence: 99%
“…Ultrasound biomedical imaging contains three components including an ultrasound transducer, a computation system and a transmission/receiving electronic circuit. In recent decades, the ultrasound transducers have been mainly investigated for accomplishing higher performance including high sensitivity and image resolution, and among them, to increase the operation frequency of the ultrasound transducer to the regime of 20 to 200 MHz [6][7][8][9][10][11][12][13][14][15] is a general trend in either clinical application and biomedical research. Other than enhancing C.M.…”
Section: Introductionmentioning
confidence: 99%