Micromachined W-band filters

Robertson, Susan; Katehi, L.P.B.; Rebeiz, Gabriel M.

doi:10.1109/22.491027

Cited by 88 publications

(38 citation statements)

References 19 publications

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“…Industry has pursued the manufacture of mm-wave and sub-mm-wave components for some years, with the production of 50 GHz microstrip components for telecommunications, and 77 GHz components for automotive radar sensors(9), micromachined W-band RF filters (10), and tapered-rod antennae at frequencies up to 850 GHz(11), providing just a few examples.…”

Section: )mentioning

confidence: 99%

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W-band sheet beam klystron simulation

Colby

Caryotakis

Fowkes

et al. 1999

AIP Conference Proceedings

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Abstract. With the development of ever higher energy particle accelerators comes the need for compactness and high gradient, which in turn require very high frequency high power rf sources. Recent development work in W-band accelerating techniques has spurred the development of a high-power W-band source. Axisymmetric sources suffer from fundamental power output limitations (P sat~λ 2 ) brought on by the conflicting requirements of small beam sizes and high beam current. The sheet beam klystron allows for an increase in beam current without substantial increase in the beam current density, allowing for reduced cathode current densities and focussing field strengths. Initial simulations of a 20:1 aspect ratio sheet beam/cavity interaction using the 3 dimensional particle-in-cell code Magic3D have demonstrated a 35% beam-power to RF power extraction efficiency. Calculational work and numerical simulations leading to a prototype W-band sheet beam klystron will be presented, together with preliminary cold test structure studies of a proposed RF cavity geometry.

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Section: )mentioning

confidence: 99%

“…For the chosen 20:1 aspect ratio, the first six modes, TE 10 through TE 60 , all are above cutoff at the klystron operating frequency. Although none of these modes is capable of being driven by a symmetric TM 110 cavity mode, imperfections of the real klystron cavities will cause some coupling to each of these modes.…”

Section: Oscillation/mode Leakage Issuesmentioning

confidence: 99%

W-band sheet beam klystron simulation

Colby

Caryotakis

Fowkes

et al. 1999

AIP Conference Proceedings

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“…The origins for this type of transmission line lie in a combination of the work conducted using a membrane-supported CPW (coplanar-waveguide) geometry on a SiO 2 /Si 3 N 4 /SiO 2 membrane [3][4][5][6][7][8] (also demonstrated using a polymer or epoxy membrane [9][10][11]), and also that involving a self-packaged, grounded CPW (GCPW) configuration using micromachined silicon [12][13][14][15][16][17]. The work described in [1,2] is an extension of these earlier types of miniature membranesupported transmission lines with the addition of full shielding and conversion to a stripline-type geometry.…”

Section: Introductionmentioning

confidence: 99%

Design of a Non-Contact Vertical Transition for a 3d Mm-Wave Multi-Chip Module Based on Shielded Membrane Supported Interconnects

Farrington¹,

Iezekiel²

2011

PIER B

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Abstract-The preliminary design concept, for a low-loss, highbandwidth electromagnetically coupled vertical transition for use as a via between adjacent levels of a 3D-MCM based on membranesupported striplines with micro-machined shielding, is presented. The design methodology, modeling using Ansoft HFSS and simulated results are presented and together represent a complete electrical characterization of the vertical transition. The simulated insertion loss of these structures is shown to be as low as 0.12 dB at 60 GHz with a 44 GHz 1 dB bandwidth. Besides studying the vertical transition, the analysis is extended to identify the range of directional coupling which can be achieved using this type of structure, which is shown to be greater than 3 dB. The structures studied rely on a versatile micromachining technique for the fabrication of the micro-shielding which allows for the conformal packaging of lines and devices, with the ultimate aim of realizing 3D system-in-a-package type modules. The concept and proposed fabrication techniques for these modules, including methods of flip-chip MMIC attachment are detailed.

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“…At higher frequencies, there has recently been substantial progress in the area of bulk-micromachining techniques for the realization of monolithic suspended stripline filters, from 20-100 GHz [67], [68]. At these frequencies, the freespace wavelength is compatible with monolithic integrated circuit fabrication techniques, and the 's that are achievable are substantially higher than those of planar integrated circuit approaches because the transmission lines are essentially "floating in air."…”

Section: B Micromachining Technology For Rfic Applicationsmentioning

confidence: 99%

“…These structures exhibit negligible dielectric losses and very little dispersion or radiative losses. A 95-GHz bandpass filter was realized in this technology and achieved a 3.4-dB insertion loss with a 6% bandwidth [68]. However, scaling this technology to lower frequencies presents some daunting challenges, because the dimensions required for the matching elements grow as the frequency drops.…”

Section: B Micromachining Technology For Rfic Applicationsmentioning

confidence: 99%

Integrated circuit technology options for RFIC's-present status and future directions

Larson

Proceedings of CICC 97 - Custom Integrated Circuits Conference

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Abstract-This paper will summarize the technology tradeoffs that are involved in the implementation of radio frequency integrated circuits for wireless communications. Radio transceiver circuits have a very broad range of requirements-including noise figure, linearity, gain, phase noise, and power dissipation. The advantages and disadvantages of each of the competing technologies-Si CMOS and bipolar junction transistors (BJT's), Si/SiGe HBT's and GaAs MESFET's, PHEMTS and HBT's will be examined in light of these requirements.

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Micromachined W-band filters

Cited by 88 publications

References 19 publications

W-band sheet beam klystron simulation

W-band sheet beam klystron simulation

Design of a Non-Contact Vertical Transition for a 3d Mm-Wave Multi-Chip Module Based on Shielded Membrane Supported Interconnects

Integrated circuit technology options for RFIC's-present status and future directions

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