Micromachined tunable Fabry-Perot filters for infrared astronomy

Mott, D. B.; Barclay, R.; Bier, Alexander; Chen, Tina C.; DiCamillo, Barbara; Deming, Drake; Greenhouse, Matthew A.; Henry, Ross; Hewagama, T.; Quijada, Manuel A.; Satyapal, S.; Schwinger, D. S.

doi:10.1117/12.461595

Cited by 11 publications

(3 citation statements)

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“…This means that even with a wafer having a very good initial flatness, it is quite difficult to manufacture MOEMS integrating a non-circular moving structure supporting a large diameter membrane (>5 mm) with a low ( λ/20) and highly reproducible flatness. This issue has already been mentioned by other authors [10,11]. Nevertheless, these high flatness values are only necessary for interferometer manufacturing, and lower flatness values (ranging from λ/2 to λ/10) can be used in other types of MOEMS.…”

Section: Flatness and Roughnessmentioning

confidence: 85%

“…This process allowed us to obtain a high yield: all the 44 membranes per wafer could be released without damage (figure 5). This release method has the advantage of not using an etch stop layer as in previous papers [10][11][12], so it does not require any harsh chemicals such as buffered HF (BHF) to remove the etch stop layer at the end of the DRIE etching. This allows the deposition of mirrors at the beginning of the manufacturing process of MOEMS devices integrating such membranes.…”

Section: Fabrication and Characterization Of Bragg Mirror Membranesmentioning

confidence: 99%

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Large area and broadband semi-reflective Bragg mirror membrane manufactured by PECVD

Bertin

Bosseboeuf

Coste

et al. 2013

J. Micromech. Microeng.

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Non-absorbing beam splitters integrated on silicon are desirable for various micro-opto electro mechanical systems (MOEMS) devices. In this paper, we demonstrate the manufacturing with a 100% yield of dielectric membranes having a diameter up to 5.9 mm and an approximately 50% reflectivity in the 570–900 nm wavelength range. The membranes are made from a stack of up to 12 alternating SiNx and SiO2 plasma enhanced chemical vapor deposition (PECVD) films deposited and annealed on silicon. Backside micromachining of the silicon wafer by deep reactive ion etching followed by XeF2 etching is used to release the membranes. Annealing effects on stress variation and hydrogen bonding in PECVD single films and multilayers were investigated in detail to get a multilayer stack with controlled tensile stress. Optical measurements of the reflectivity, flatness and vibrations of these membranes show that they are suitable for use in MOEMS devices working in the visible-near infrared range.

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Section: Flatness and Roughnessmentioning

confidence: 85%

Section: Fabrication and Characterization Of Bragg Mirror Membranesmentioning

confidence: 99%

Large area and broadband semi-reflective Bragg mirror membrane manufactured by PECVD

Bertin

Bosseboeuf

Coste

et al. 2013

J. Micromech. Microeng.

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show abstract

“…It is developed by NASA for infrared spectrometry applications and is shown in Figure 10. The spacing between the mirror elements, in the centre of the disk, is controlled by a pair of capacitor plates on the perimeter of the disk [19, 20].…”

Section: Opticsmentioning

confidence: 99%

The Future of Microelectromechanical systems (MEMS)

Marinis

2009

Strain

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MEMS-based products produced in 2005 had a value of $8bn, 40% of which was sensors. The balance was for products that included micromachined features, such as ink jet print heads, catheters and RF IC chips with embedded inductors. Growth projections follow a hockey stick curve, with the value of products rising to $40bn in 2015 and $200bn in 2025! Growth to date has come from a combination of technology displacement, as exemplified by automotive pressure sensors and airbag accelerometers and new products, such as miniaturised guidance systems for military applications and wireless tire pressure sensors. Much of the growth in MEMS business is expected to come from products that are in the early stages of development or yet to be invented. Some of these devices include disposable chips for performing assays on blood and tissue samples, which are now performed in hospital laboratories, integrated optical switching and processing chips, and various RF communication and remote sensing products. The key to enabling the projected 25fold growth in MEMS products is development of appropriate technologies for integrating multiple devices with electronics on a single chip. At present, there are two approaches to integrating MEMS devices with electronics. Either the MEMS device is fabricated in polysilicon, as part of the CMOS wafer fabrication sequence or a discrete MEMS device is packaged with a separate ASIC chip. Neither of these approaches is entirely satisfactory, though, for building the high-value, system-onchip products that are envisioned. It is this author's opinion that a combination of self-assembly techniques in conjunction with wafer stacking, offer a viable path to realizing ubiquitous, complex MEMS systems.

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Wireless MEMS for space applications

Osiander

Darrin

2017

Wireless MEMS Networks and Applications

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Micromachined tunable Fabry-Perot filters for infrared astronomy

Cited by 11 publications

References 0 publications

Large area and broadband semi-reflective Bragg mirror membrane manufactured by PECVD

Large area and broadband semi-reflective Bragg mirror membrane manufactured by PECVD

The Future of Microelectromechanical systems (MEMS)

Wireless MEMS for space applications

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