2017 IEEE MTT-S International Microwave Symposium (IMS) 2017
DOI: 10.1109/mwsym.2017.8058653
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Micromachined terahertz waveguide band-pass filters

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Cited by 8 publications
(3 citation statements)
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“…100 to 300 GHz) MPRWG BPFs reported in the open literature employ highaccuracy micromachining technologies, achieving close agreement with design specifications. Examples include CNC milling [40] and laser micromachining [41] at W-band, SU8 micromachining at J-band [42] and deep reactive-ion etching (DRIE) at WM-250 [43]. A full literature review of micromachined sub-THz COTS MPRWG BPFs has already been published [9].…”
Section: Bandpass Filtersmentioning
confidence: 99%
“…100 to 300 GHz) MPRWG BPFs reported in the open literature employ highaccuracy micromachining technologies, achieving close agreement with design specifications. Examples include CNC milling [40] and laser micromachining [41] at W-band, SU8 micromachining at J-band [42] and deep reactive-ion etching (DRIE) at WM-250 [43]. A full literature review of micromachined sub-THz COTS MPRWG BPFs has already been published [9].…”
Section: Bandpass Filtersmentioning
confidence: 99%
“…The design of resonators with high unloaded quality factors QU at THz frequencies remains a challenging problem. Several waveguide filters in the WM-380 (WR-1.5) band (500-750 GHz) fabricated by micromachining have been reported in [1][2][3][4]; these filters used TE101 resonators and exhibited low QU. The losses in micromachined waveguide cavities can be reduced by advanced fabrication methods improving surface roughness and quality of metallization; these approaches require extensive development effort and cost.…”
Section: Introductionmentioning
confidence: 99%
“…Apart from CNC milling, several photolithography-based micromachining technologies have been reported to be capable of not only producing 3-D structures with high accuracy and large aspect ratio but also of facilitating large-scale inexpensive fabrication. These techniques include silicon deep reactive ion etching (Si-DRIE) [10], [11], LIthographie, Galvanoformung and Abformung (LIGA) [12], metal electroforming [13], [14], and SU-8 photoresist technology [15]- [20]. A wide range of passive devices, with excellent performance, have been demonstrated using these micromachining techniques [19].…”
Section: Introductionmentioning
confidence: 99%