1997
DOI: 10.1088/0960-1317/7/4/009
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Micromachined mold-type double-gated metal field emitters

Abstract: Electron field emitters with double gates were fabricated using micromachining technology and the effect of the electric potential of the focusing gate (or second gate) was experimentally evaluated. The molybdenum field emission tip was made by filling a cusplike mold formed when a conformal film was deposited on the hole-trench that had been patterned on stacked metals and dielectric layers. The hole-trench was patterned by electron beam lithography and reactive ion etching. Each field emitter has a diameter… Show more

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Cited by 3 publications
(2 citation statements)
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“…24 The addition of the second gate to form a vertical triode structure for focusing operation was demonstrated experimentally in 1995. Local and out-of-plane focusing electrodes have been fabricated for most types of FEA, including Si wafer-molded 29 and cusp-molded emitters, 30 Spindt-type emitters, 31 etched Si emitters, 27,25,32 and carbon nanotube ͑CNT͒ emitters. Methods to electrically screen the tip included positioning it below the gate 26 or increasing the extractor gate thickness.…”
Section: Introductionmentioning
confidence: 99%
“…24 The addition of the second gate to form a vertical triode structure for focusing operation was demonstrated experimentally in 1995. Local and out-of-plane focusing electrodes have been fabricated for most types of FEA, including Si wafer-molded 29 and cusp-molded emitters, 30 Spindt-type emitters, 31 etched Si emitters, 27,25,32 and carbon nanotube ͑CNT͒ emitters. Methods to electrically screen the tip included positioning it below the gate 26 or increasing the extractor gate thickness.…”
Section: Introductionmentioning
confidence: 99%
“…The wide vacuum gap demands a design of structures capable of focusing. Several focusing structures have been reported: double-gated type, [1][2][3][4][5][6] planar-electrode type 7,8) and self-focus cathode electrode type. 9) In a double-gated type structure, a focus gate electrode (FEG) is stacked on the extraction gate electrode (EGE) with an additional insulating layer, where the additional insulating layer is required to sustain electrical breakdown between EGE and FGE.…”
Section: Introductionmentioning
confidence: 99%