Microhardness variation and related microstructure in Al–Cu alloys prepared by HF induction melting and RF sputtering

Boukhris, N.; Lallouche, S.; Debili, M.Y.; Draissia, M.

doi:10.1051/epjap/2009016

Cited by 17 publications

(6 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Mondolfo [73] mentions that disk shaped, fully coherent Guinier-Preston zones (G-PI) form slowly in thin Al-Cu films while the stable incoherent phase h nucleates rapidly. There are some other papers [17,39,66] in literature confirming that h is usually the only phase present in Al-Cu thin films, sometimes accompanied by the semi-coherent phase h 0 . Mader and Herd [65] studied Al-Cu thin films with 100-200 nm thickness by a heat treatment of the solid solution alloy between 100-300°C.…”

Section: Introductionmentioning

confidence: 91%

See 1 more Smart Citation

Gradient crystal plasticity modelling of anelastic effects in particle strengthened metallic thin films

2014

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 91%

“…Since the focus of this work is on applicability to thin films, in which GP zones are either significantly smaller in number and size or not observed [17,39,63,65,66,73], in contrast to bulk materials, particles are assumed to have a spherical shape. It is assumed further that they have a constant volume fraction and size (i.e.…”

Section: The Extended Sgcp Modelmentioning

confidence: 99%

Gradient crystal plasticity modelling of anelastic effects in particle strengthened metallic thin films

2014

View full text Add to dashboard Cite

“…3 Also, increased Cu content usually increases the hardness values up to a peak, while increased θ CuAl 2 proportion increases brittleness. 4 Kim et al 2 found maximum hardness at ~50 vol. % Cu for spark plasma sintered samples with only θ and γ' phases.…”

Section: Introductionmentioning

confidence: 99%

Induction melting of an Al-50Cu alloy for improved homogeneity required for powder spheroidisation

Merwe

Bissett

Walt

et al. 2022

SATNT

View full text Add to dashboard Cite

Copper alloys are typically produced by conventional casting processes, including spark plasma sintering (SPS), which often produce inhomogeneous mixtures of Cu or Al precipitates and unwanted intermetallic phases in solid products. Induction melting should provide good mixing, controlled heating and melt stirring, potentially improving homogeneity. Homogeneous melts should produce homogeneous powders, giving better properties in additive manufacturing (AM). To ascertain homogeneity, a density test was developed. After comminution, homogeneous powders can be used to produce high quality components. To manufacture dense AM components, spheroidised powders are needed because they increase particle packing and powder flow. An Al-50Cu (at.%) button was produced by high-frequency (HF) induction melting, to give better mixing and hence phase distributions. To identify the phases and their distributions, the as-cast sample was studied using scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD), as well as absolute density using helium pycnometry. Results indicated inhomogeneity in the samples, due to Al loss, complex solidification and the densest phase settling at the bottom of the button.

show abstract

“…Some researches found that in Al-Cu [7,8,10] and 11] alloy films, intermetallic compounds formed at alloy contents great than 1.8 at.% Cu or 50 at.% Fe, respectively. In the case of Al-Ti films however, two different views exist.…”

Section: Introductionmentioning

confidence: 99%

“…Some researches believe that in the systems of sputtered Al-based films (e. g., Al-Cr [3], Al-Mo [4], Al-W [5], Al-Mg [9]), when the solute content is much greater than the solid solute limit and even the films possess an amorphous structure, no intermetallic compounds would form. Some researches found that in Al-Cu [7,8,10] and Al-Fe [6,11] alloy films, intermetallic compounds formed at alloy contents great than 1.8 at.% Cu or 50 at.% Fe, respectively. In the case of Al-Ti films however, two different views exist.…”

Section: Introductionmentioning

confidence: 99%

Formation of intermetallic compounds and their effect on mechanical properties of aluminum–titanium alloy films

Shang

et al. 2017

International Journal of Materials Research

View full text Add to dashboard Cite

Formation of intermetallic compounds and their effect on mechanical properties of aluminum-titanium alloy filmsAl-Ti alloy films with various Ti contents were prepared through magnetron co-sputtering with Al and Ti targets and treated with vacuum annealing at 400 8C. Energy dispersive spectroscopy, X-ray diffraction, transmission electron microscopy, X-ray photoelectron spectroscopy and nanoindentation were used to determine the composition, microstructure and hardness of the films to reveal the existence of intermetallic compounds and their effects on the microstructure and mechanical properties. The results showed that Al-Ti films with lower Ti contents formed nanocrystalline structures of highly supersaturated solid solution. With the increase of Ti content, various types of Al-Ti intermetallic compound bonds formed. The existence and increasing concentration of these compound bonds gradually transformed the films into amorphous structures and supported the continual increase of the film hardness, reaching a high value of 8.8 GPa at 36.3 at.% Ti.Keywords: Highly supersaturated solid solution; Intermetallic compound bond; Al-based alloy film; Mechanical properties IntroductionAlloy films prepared by physical vapor deposition (PVD) exhibit features of highly supersaturated solid solution (i. e., solute content significantly higher than that of the equilibrium solid solubility). This type of structure remarkably improves film performance [1,2]. For instance, existing studies [3 -8] have demonstrated that, when some sputtered Al alloy films form highly supersaturated solid solution, their hardness can reach up to about 8 GPa, equivalent to the hardness level of high-speed steel. This technique therefore became an important approach to produce films with desired properties. However, controversy still exists regarding the underlying driver of the hardness enhancement, especially when the solute content far exceeds its equilibrium solubility limit: whether it is due to structure changes (e. g., highly supersaturated solid solution, or nanocrystal/amorphous structure) or the formation of intermetallic compounds. Some researches believe that in the systems of sputtered Al-based films (e. g., Al-Cr, when the solute content is much greater than the solid solute limit and even the films possess an amorphous structure, no intermetallic compounds would form. Some researches found that in Al-Cu [7,8,10] and 11] alloy films, intermetallic compounds formed at alloy contents great than 1.8 at.% Cu or 50 at.% Fe, respectively. In the case of Al-Ti films however, two different views exist. One maintains that intermetallic compounds cannot form in these films [3,6,9] while the other believes it is possible [12]. These different reports on the existence of the intermetallic compounds demonstrate that there is currently no consensus regarding the underlying cause of the alloy hardness enhancement. This paper reveals conditions and causes of the formation of intermetallic compound bonds in alloy films, through in-

show abstract

Microhardness variation and related microstructure in Al–Cu alloys prepared by HF induction melting and RF sputtering

Cited by 17 publications

References 16 publications

Gradient crystal plasticity modelling of anelastic effects in particle strengthened metallic thin films

Gradient crystal plasticity modelling of anelastic effects in particle strengthened metallic thin films

Induction melting of an Al-50Cu alloy for improved homogeneity required for powder spheroidisation

Formation of intermetallic compounds and their effect on mechanical properties of aluminum–titanium alloy films

Contact Info

Product

Resources

About